Sakai; Kunito
Patent Applications and Registrations
Patent applications and USPTO patent grants for Sakai; Kunito.The latest application filed is for "encapsulation method".
- Sakai; Kunito - Hyogo-ken JP
- Sakai; Kunito - Hyogo JP
- Sakai; Kunito - Amagasaki JP
| Patent | Date |
|---|---|
| Encapsulation method Grant 5,798,070 - Sakai , et al. August 25, 1 | 1998-08-25 |
| Method for packaging semiconductor devices in a resin Grant 5,082,615 - Sakai January 21, 1 | 1992-01-21 |
| Method for producing a tablet for resin-molding semiconductor devices and resin-molding method making use of the tablet Grant 4,963,307 - Sakai , et al. October 16, 1 | 1990-10-16 |
| Method of resin encapsulating a semiconductor device Grant 4,769,344 - Sakai , et al. September 6, 1 | 1988-09-06 |
| Semiconductor device Grant 4,717,948 - Sakai , et al. January 5, 1 | 1988-01-05 |
| Semiconductor device and manufacturing method therefor Grant 4,697,203 - Sakai , et al. September 29, 1 | 1987-09-29 |
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