Sakai; Kazunaga

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sakai; Kazunaga.The latest application filed is for "varnish, prepreg, film with resin, metal foil-clad laminate, and printed circuit board".

Company Profile

1.5.6

Sakai; Kazunaga - Ibaraki JP
Sakai; Kazunaga - Chikusei N/A JP
Sakai; Kazunaga - Oyama-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Varnish, prepreg, film with resin, metal foil-clad laminate, and printed circuit board Grant 10,465,089 - Morita , et al. No	2019-11-05
Varnish, Prepreg, Film With Resin, Metal Foil-clad Laminate, And Printed Circuit Board App 20190002728 - MORITA; Kouji ; et al.	2019-01-03
Varnish, Prepreg, Film With Resin, Metal Foil-clad Laminate, And Printed Circuit Board App 20160083614 - MORITA; Kouji ; et al.	2016-03-24
Varnish, prepreg, film with resin, metal foil-clad laminate, and printed circuit board Grant 9,265,145 - Morita , et al. February 16, 2	2016-02-16
Resin composition, prepreg, laminate, and wiring board Grant 9,078,365 - Morita , et al. July 7, 2	2015-07-07
Varnish, Prepreg, Film With Resin, Metal Foil-clad Laminate, And Printed Circuit Board App 20130008695 - Morita; Kouji ; et al.	2013-01-10
Resin Composition, Prepreg, Laminate, And Wiring Board App 20090200071 - Morita; Koji ; et al.	2009-08-13
Prepreg and laminate and printed wiring board using the same App 20060105176 - Narabu; Yoshiyuki ; et al.	2006-05-18
Phenol resin composition and phenol resin copper-clad laminate App 20050008882 - Satou, Miki ; et al.	2005-01-13

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