Sakai; Haruhiko

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sakai; Haruhiko.The latest application filed is for "power source integrated vacuum pump".

Company Profile

1.7.9

Sakai; Haruhiko - Kyoto JP
Sakai; Haruhiko - Machida JP
Sakai; Haruhiko - Ota JP
SAKAI; Haruhiko - Ota-City JP
SAKAI; Haruhiko - Ota-shi JP
Sakai; Haruhiko - Gunma JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Power source integrated vacuum pump having a power source with a substrate in contact with and covering a portion of a cooling surface which is also covered by a heat insulating plate Grant 10,941,787 - Sakai , et al. March 9, 2	2021-03-09
Power Source Integrated Vacuum Pump App 20180306204 - SAKAI; Haruhiko ; et al.	2018-10-25
Slide Rail And Electronic Apparatus App 20160369844 - ITO; Hisashi ; et al.	2016-12-22
Computer System, Switching Device, And Switching Method App 20150356042 - Ochiai; Shingo ; et al.	2015-12-10
Semiconductor device, semiconductor module, method for manufacturing semiconductor device, and lead frame Grant 8,241,958 - Sakai August 14, 2	2012-08-14
Semiconductor Device, Semiconductor Module, Method For Manufacturing Semiconductor Device, And Lead Frame App 20110024883 - SAKAI; Haruhiko	2011-02-03
Semiconductor device, semiconductor module, method for manufacturing semiconductor device, and lead frame Grant 7,839,004 - Sakai November 23, 2	2010-11-23
Semiconductor Device, Semiconductor Module, Method For Manufacturing Semiconductor Device, And Lead Frame App 20100025828 - SAKAI; Haruhiko	2010-02-04
Semiconductor device and switching element Grant 7,030,501 - Yoshiba , et al. April 18, 2	2006-04-18
Semiconductor device and switching element App 20050017339 - Yoshiba, Shigeharu ; et al.	2005-01-27
Semiconductor device and packaging system therefore Grant 6,833,608 - Asano , et al. December 21, 2	2004-12-21
Multilayer wiring board with mounting pad Grant 6,833,616 - Asano , et al. December 21, 2	2004-12-21
Semiconductor device Grant 6,818,969 - Asano , et al. November 16, 2	2004-11-16
Semiconductor device App 20030151137 - Asano, Tetsuro ; et al.	2003-08-14
Semiconductor device and packaging system therefore App 20030137044 - Asano, Tetsuro ; et al.	2003-07-24
Semiconductor device App 20030094679 - Asano, Tetsuro ; et al.	2003-05-22

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