Sakaguchi; Hideaki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sakaguchi; Hideaki.The latest application filed is for "bioelectrode component".

Company Profile

5.94.102

Sakaguchi; Hideaki - Nagano JP
Sakaguchi; Hideaki - Nagano-shi JP
- Nagano JP
Sakaguchi; Hideaki - Nagano-ken N/A JP
Sakaguchi; Hideaki - Tenri JP
Sakaguchi, Hideaki - Tenri-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Bioelectrode component Grant 10,588,533 - Sakaguchi , et al.	2020-03-17
Bioelectrode Component App 20190143091 - Sakaguchi; Hideaki ; et al.	2019-05-16
Electronic device Grant 10,206,283 - Sakaguchi Feb	2019-02-12
Electronic part embedded substrate and method of producing an electronic part embedded substrate Grant 10,134,680 - Yamano , et al. November 20, 2	2018-11-20
Electronic Part Embedded Substrate And Method Of Producing An Electronic Part Embedded Substrate App 20170365559 - YAMANO; Takaharu ; et al.	2017-12-21
Electronic part embedded substrate and method of producing an electronic part embedded substrate Grant 9,768,122 - Yamano , et al. September 19, 2	2017-09-19
Interposer, method for manufacturing interposer, and semiconductor device Grant 9,646,924 - Sakaguchi May 9, 2	2017-05-09
Interposer and semiconductor device including the same Grant 9,591,742 - Murayama , et al. March 7, 2	2017-03-07
Electronic Part Embedded Substrate And Method Of Producing An Electronic Part Embedded Substrate App 20160358858 - YAMANO; Takaharu ; et al.	2016-12-08
Chip embedded substrate and method of producing the same Grant 9,451,702 - Yamano , et al. September 20, 2	2016-09-20
Cap, semiconductor device including the cap, and manufacturing method therefor Grant 9,434,604 - Fujihara , et al. September 6, 2	2016-09-06
Cap, Semiconductor Device Including The Cap, And Manufacturing Method Therefor App 20150263238 - FUJIHARA; Kosuke ; et al.	2015-09-17
Probe card and manufacturing method thereof Grant 9,052,341 - Shiraishi , et al. June 9, 2	2015-06-09
Test-use individual substrate, probe, and semiconductor wafer testing apparatus Grant 8,922,232 - Matsumura , et al. December 30, 2	2014-12-30
Probe card and method for manufacturing probe card Grant 8,922,234 - Shiraishi , et al. December 30, 2	2014-12-30
Probe card and method for manufacturing probe card Grant 08922234 -	2014-12-30
Interposer, Method For Manufacturing Interposer, And Semiconductor Device App 20140376189 - SAKAGUCHI; Hideaki	2014-12-25
Interposer And Semiconductor Device Including The Same App 20140362552 - Murayama; Kei ; et al.	2014-12-11
Chip Embedded Substrate And Method Of Producing The Same App 20140313681 - YAMANO; Takaharu ; et al.	2014-10-23
Wiring board, semiconductor device, and method for manufacturing wiring board Grant 8,810,007 - Takano , et al. August 19, 2	2014-08-19
Chip embedded substrate and method of producing the same Grant 8,793,868 - Yamano , et al. August 5, 2	2014-08-05
Wiring board and method of manufacturing the same Grant 8,777,638 - Sakaguchi , et al. July 15, 2	2014-07-15
Wiring substrate and method of manufacturing the wiring substrate Grant 8,759,685 - Sakaguchi , et al. June 24, 2	2014-06-24
Substrate manufacturing method Grant 8,671,561 - Iida , et al. March 18, 2	2014-03-18
Wiring board, semiconductor device, and method for manufacturing wiring board Grant 8,669,643 - Takano , et al. March 11, 2	2014-03-11
Package for electronic component, manufacturing method thereof and sensing apparatus Grant 8,564,077 - Shiraishi , et al. October 22, 2	2013-10-22
Interposer, its manufacturing method, and semiconductor device Grant 8,536,714 - Sakaguchi September 17, 2	2013-09-17
Wiring substrate and semiconductor device Grant 8,350,390 - Murayama , et al. January 8, 2	2013-01-08
Wiring Board And Manufacturing Method Of The Same App 20130000955 - SAKAGUCHI; Hideaki ; et al.	2013-01-03
Electronic Component App 20120327574 - SAKAGUCHI; Hideaki ; et al.	2012-12-27
Wiring Board And Method Of Manufacturing The Same App 20120325529 - SAKAGUCHI; Hideaki ; et al.	2012-12-27
Interposer, Its Manufacturing Method, And Semiconductor Device App 20120326334 - SAKAGUCHI; Hideaki	2012-12-27
Semiconductor Package App 20120319289 - MORI; Kenichi ; et al.	2012-12-20
Wiring board having heat intercepting member Grant 8,330,050 - Sakaguchi , et al. December 11, 2	2012-12-11
Wiring board and manufacturing method of the same Grant 8,314,344 - Sakaguchi , et al. November 20, 2	2012-11-20
Electronic component built-in substrate and method of manufacturing the same Grant 8,309,860 - Sunohara , et al. November 13, 2	2012-11-13
Semiconductor package and manufacturing method of the same Grant 8,304,862 - Taguchi , et al. November 6, 2	2012-11-06
Conductive ball mounting apparatus having a movable conductive ball container Grant 8,299,628 - Sakaguchi , et al. October 30, 2	2012-10-30
Wiring board and method of manufacturing the same Grant 8,299,370 - Sakaguchi , et al. October 30, 2	2012-10-30
Wiring Board, Semiconductor Device, and Method for Manufacturing Wiring Board App 20120261832 - TAKANO; Akihito ; et al.	2012-10-18
Wiring Board, Semiconductor Device, and Method for Manufacturing Wiring Board App 20120261801 - TAKANO; Akihito ; et al.	2012-10-18
Probe Card And Manufacturing Method Thereof App 20120229157 - SHIRAISHI; Akinori ; et al.	2012-09-13
Semiconductor package and method of manufacturing the same Grant 8,227,909 - Sakaguchi , et al. July 24, 2	2012-07-24
Electronic part package Grant 8,183,679 - Sakaguchi , et al. May 22, 2	2012-05-22
Method of manufacturing wiring substrate Grant 8,137,497 - Sunohara , et al. March 20, 2	2012-03-20
Test-use Individual Substrate, Probe, And Semiconductor Wafer Testing Apparatus App 20120049876 - MATSUMURA; Shigeru ; et al.	2012-03-01
Method of manufacturing wiring substrate, and method of manufacturing semiconductor device Grant 8,108,993 - Higashi , et al. February 7, 2	2012-02-07
Method of manufacturing wiring substrate and method of manufacturing semiconductor device Grant 8,080,122 - Sunohara , et al. December 20, 2	2011-12-20
Semiconductor package and manufacturing method thereof Grant 8,053,886 - Taguchi , et al. November 8, 2	2011-11-08
Electronic Part Package App 20110266697 - SAKAGUCHI; Hideaki ; et al.	2011-11-03
Probe Card And Method For Manufacturing Probe Card App 20110260744 - Shiraishi; Akinori ; et al.	2011-10-27
Light-emitting device and method for manufacturing the same Grant 8,044,429 - Higashi , et al. October 25, 2	2011-10-25
Chip Embedded Substrate And Method Of Producing The Same App 20110256662 - YAMANO; Takaharu ; et al.	2011-10-20
Method for producing electronic part package Grant 8,008,120 - Sakaguchi , et al. August 30, 2	2011-08-30
Chip embedded substrate and method of producing the same Grant 7,989,707 - Yamano , et al. August 2, 2	2011-08-02
Method of manufacturing substrate Grant 7,981,798 - Taguchi , et al. July 19, 2	2011-07-19
Semiconductor Package And Method Of Manufacturing The Same App 20110156242 - Sakaguchi; Hideaki ; et al.	2011-06-30
Wiring Substrate And Semiconductor Device App 20110147951 - MURAYAMA; Kei ; et al.	2011-06-23
Method For Producing Electronic Part Package App 20110092020 - SAKAGUCHI; Hideaki ; et al.	2011-04-21
Conductive ball mounting apparatus and conductive ball mounting method Grant 7,900,807 - Iida , et al. March 8, 2	2011-03-08
Method for producing electronic part package Grant 7,897,432 - Sakaguchi , et al. March 1, 2	2011-03-01
Probe card Grant 7,888,953 - Taguchi , et al. February 15, 2	2011-02-15
Light-emitting Device And Method For Manufacturing The Same App 20110032710 - Higashi; Mitsutoshi ; et al.	2011-02-10
Conductive Ball Mounting Method And Apparatus App 20110023292 - Sakaguchi; Hideaki ; et al.	2011-02-03
Light emitting apparatus and manufacturing method therefor Grant 7,876,036 - Taguchi , et al. January 25, 2	2011-01-25
Conductor ball mounting apparatus, conductor ball mounting method, mask used for mounting conductor ball, and mask manufacturing method Grant 7,866,534 - Sakaguchi , et al. January 11, 2	2011-01-11
Method for producing substrate Grant 7,867,894 - Sakaguchi January 11, 2	2011-01-11
Conductive ball removing method, conductive ball mounting method, conductive ball removing apparatus, and conductive ball mounting apparatus Grant 7,866,533 - Tanaka , et al. January 11, 2	2011-01-11
Method of mounting conductive ball and conductive ball mounting apparatus Grant 7,854,366 - Sakaguchi , et al. December 21, 2	2010-12-21
Apparatus and method for arranging magnetic solder balls Grant 7,854,367 - Sakaguchi , et al. December 21, 2	2010-12-21
Light-emitting device and method for manufacturing the same Grant 7,838,897 - Higashi , et al. November 23, 2	2010-11-23
Sealed structure and method of fabricating sealed structure and semiconductor device and method of fabricating semiconductor device Grant 7,834,438 - Shiraishi , et al. November 16, 2	2010-11-16
Conductive ball mounting method and apparatus having a movable solder ball container Grant 7,829,451 - Sakaguchi , et al. November 9, 2	2010-11-09
Semiconductor device and method of manufacturing semiconductor device Grant 7,825,423 - Shiraishi , et al. November 2, 2	2010-11-02
Apparatus And Method For Arranging Magnetic Solder Balls App 20100270364 - SAKAGUCHI; Hideaki ; et al.	2010-10-28
Conductive ball mounting method Grant 7,820,479 - Sakaguchi October 26, 2	2010-10-26
Conductive Ball Mounting Apparatus And Conductive Ball Mounting Method App 20100230469 - IIDA; Kiyoaki ; et al.	2010-09-16
Method of manufacturing substrate Grant 7,795,140 - Taguchi , et al. September 14, 2	2010-09-14
Substrate and mask aligning apparatus Grant 7,788,061 - Takeuchi , et al. August 31, 2	2010-08-31
Apparatus and method for arranging magnetic solder balls Grant 7,784,671 - Sakaguchi , et al. August 31, 2	2010-08-31
Wiring Board And Method Of Manufacturing The Same App 20100212950 - SAKAGUCHI; Hideaki ; et al.	2010-08-26
Semiconductor Package And Manufacturing Method Of The Same App 20100155928 - Taguchi; Yuichi ; et al.	2010-06-24
Package For Electronic Component, Manufacturing Method Thereof And Sensing Apparatus App 20100155862 - Shiraishi; Akinori ; et al.	2010-06-24
Wiring Substrate And Method Of Manufacturing The Wiring Substrate App 20100108361 - Sakaguchi; Hideaki ; et al.	2010-05-06
Semiconductor Device And Method Of Manufacturing The Same App 20100109160 - SAKAGUCHI; Hideaki ; et al.	2010-05-06
Method of producing light emitting apparatus Grant 7,708,613 - Taguchi , et al. May 4, 2	2010-05-04
Electronic Component Built-in Substrate And Method Of Manufacturing The Same App 20100101849 - Sunohara; Masahiro ; et al.	2010-04-29
Conductive ball mounting apparatus and conductive ball mounting method Grant 7,703,662 - Iida , et al. April 27, 2	2010-04-27
Wiring Board And Method Of Manufacturing The Same App 20100096163 - SAKAGUCHI; Hideaki ; et al.	2010-04-22
Wiring Board And Manufacturing Method Of The Same App 20100089631 - Sakaguchi; Hideaki ; et al.	2010-04-15
Method For Producing Electronic Part Package App 20100062564 - SAKAGUCHI; Hideaki ; et al.	2010-03-11
Semiconductor Package And Manufacturing Method Thereof App 20100038772 - TAGUCHI; Yuichi ; et al.	2010-02-18
Semiconductor device and method for manufacturing the same Grant 7,655,956 - Sunohara , et al. February 2, 2	2010-02-02
Solder ball mounting method and solder ball mounting apparatus Grant 7,644,856 - Sakaguchi January 12, 2	2010-01-12
Light Emitting Diode And Method For Manufacturing The Same App 20100001304 - Higashi; Mitsutoshi ; et al.	2010-01-07
Method Of Manufacturing Wiring Substrate And Chip Tray App 20090300911 - Higashi; Mitsutoshi ; et al.	2009-12-10
Light emitting diode and method for manufacturing the same Grant 7,622,317 - Higashi , et al. November 24, 2	2009-11-24
Light emitting device and manufacturing method thereof Grant 7,622,747 - Taguchi , et al. November 24, 2	2009-11-24
Probe Card App 20090284276 - TAGUCHI; Yuichi ; et al.	2009-11-19
Apparatus and method of mounting conductive ball Grant 7,597,233 - Sakaguchi , et al. October 6, 2	2009-10-06
Method Of Manufacturing Wiring Substrate App 20090242107 - Sunohara; Masahiro ; et al.	2009-10-01
Method Of Manufacturing Wiring Substrate, And Method Of Manufacturing Semiconductor Device App 20090236024 - HIGASHI; Mitsutoshi ; et al.	2009-09-24
Wiring Substrate And Method Of Manufacturing The Same, And Semiconductor Device And Method Of Manufacturing The Same App 20090236727 - MURAYAMA; Kei ; et al.	2009-09-24
Method Of Manufacturing Wiring Substrate And Method Of Manufacturing Semiconductor Device App 20090236031 - Sunohara; Masahiro ; et al.	2009-09-24
Conductive Ball Removing Method, Conductive Ball Mounting Method, Conductive Ball Removing Apparatus, And Conductive Ball Mounting Apparatus App 20090159646 - Tanaka; Kazuo ; et al.	2009-06-25
Method Of Forming Conductive Bumps App 20090130838 - SAKAGUCHI; Hideaki ; et al.	2009-05-21
Method For Producing Substrate App 20090117738 - SAKAGUCHI; Hideaki	2009-05-07
Semiconductor device having through electrode and method of manufacturing the same Grant 7,524,753 - Sunohara , et al. April 28, 2	2009-04-28
Semiconductor Package And Manufacturing Method Thereof App 20090095974 - Taguchi; Yuichi ; et al.	2009-04-16
Substrate Dividing Method App 20090098712 - Taguchi; Yuichi ; et al.	2009-04-16
Method Of Manufacturing Substrate App 20090093117 - Taguchi; Yuichi ; et al.	2009-04-09
Solder ball mounting method and solder ball mounting substrate manufacturing method Grant 7,514,351 - Sakaguchi April 7, 2	2009-04-07
Method Of Manufacturing Substrate App 20090081867 - TAGUCHI; Yuichi ; et al.	2009-03-26
Method of forming solder connection portions, method of forming wiring substrate and method of producing semiconductor device Grant 7,507,655 - Sakaguchi , et al. March 24, 2	2009-03-24
Apparatus And Method For Arranging Magnetic Solder Balls App 20090072012 - SAKAGUCHI; Hideaki ; et al.	2009-03-19
Method Of Mounting Conductive Ball And Conductive Ball Mounting Apparatus App 20090072011 - SAKAGUCHI; Hideaki ; et al.	2009-03-19
Method for manufacturing semiconductor device Grant 7,494,898 - Sunohara , et al. February 24, 2	2009-02-24
Semiconductor device and manufacturing method of semiconductor device Grant 7,488,094 - Murayama , et al. February 10, 2	2009-02-10
Substrate And Mask Aligning Apparatus App 20090030640 - Takeuchi; Yukiharu ; et al.	2009-01-29
Apparatus And Method Of Mounting Conductive Ball App 20090026247 - Sakaguchi; Hideaki ; et al.	2009-01-29
Conductive Ball Mounting Method And Apparatus App 20090023282 - Sakaguchi; Hideaki ; et al.	2009-01-22
Conductive Ball Mounting Method App 20090020591 - Sakaguchi; Hideaki	2009-01-22
Conductor Ball Mounting Apparatus, Conductor Ball Mounting Method, Mask Used For Mounting Conductor Ball, And Mask Manufacturing Method App 20090008433 - Sakaguchi; Hideaki ; et al.	2009-01-08
Chip Embedded Substrate And Method Of Producing The Same App 20090008765 - Yamano; Takaharu ; et al.	2009-01-08
Optical device Grant 7,470,891 - Koizumi , et al. December 30, 2	2008-12-30
Substrate Manufacturing Method And Apparatus App 20080301935 - IIDA; Kiyoaki ; et al.	2008-12-11
Method Of Manufacturing Optical Device App 20080299303 - Kobayashi; Suguru ; et al.	2008-12-04
Conductive Ball Mounting Apparatus And Conductive Ball Mounting Method App 20080217386 - IIDA; Kiyoaki ; et al.	2008-09-11
Solder Ball Mounting Method And Solder Ball Mounting Apparatus App 20080105734 - Sakaguchi; Hideaki	2008-05-08
Solder Ball Mounting Method And Solder Ball Mounting Substrate Manufacturing Method App 20080102620 - Sakaguchi; Hideaki	2008-05-01
Method Of Forming Solder Connection Portions, Method Of Forming Wiring Substrate And Method Of Producing Semiconductor Device App 20070234563 - Sakaguchi; Hideaki ; et al.	2007-10-11
Semiconductor device and method of manufacturing semiconductor device App 20070194712 - Shiraishi; Akinori ; et al.	2007-08-23
Light-emitting Device And Method For Manufacturing The Same App 20070187706 - Higashi; Mitsutoshi ; et al.	2007-08-16
Optical Device App 20070181778 - Koizumi; Naoyuki ; et al.	2007-08-09
Light emitting apparatus and manufacturing method therefor App 20070182307 - Taguchi; Yuichi ; et al.	2007-08-09
Semiconductor device and method of manufacturing semiconductor device App 20070176197 - Shiraishi; Akinori ; et al.	2007-08-02
Sealed Structure And Method Of Fabricating Sealed Structure And Semiconductor Device And Method Of Fabricating Semiconductor Device App 20070177360 - Shiraishi; Akinori ; et al.	2007-08-02
Method of producing light emitting apparatus App 20070173165 - Taguchi; Yuichi ; et al.	2007-07-26
Method for manufacturing semiconductor device App 20070161211 - Sunohara; Masahiro ; et al.	2007-07-12
Method of manufacturing light emitting apparatus App 20070161316 - Taguchi; Yuichi ; et al.	2007-07-12
Light emitting device and manufacturing method thereof App 20070158674 - Taguchi; Yuichi ; et al.	2007-07-12
Semiconductor device and method for manufacturing the same App 20070145400 - Sunohara; Masahiro ; et al.	2007-06-28
Semicondcutor device and manufacturing method of semiconductor device App 20070145404 - Murayama; Kei ; et al.	2007-06-28
Method for dicing wafer Grant 7,211,370 - Sakaguchi , et al. May 1, 2	2007-05-01
Light Emitting Diode And Method For Manufacturing The Same App 20070051966 - Higashi; Mitsutoshi ; et al.	2007-03-08
Capacitor, circuit board with built-in capacitor and method of manufacturing the same Grant 7,169,195 - Sakaguchi , et al. January 30, 2	2007-01-30
Semiconductor Device Having Through Electrode And Method Of Manufacturing The Same App 20060286789 - Sunohara; Masahiro ; et al.	2006-12-21
Substrate-embedded capacitor, production method thereof, and circuit board Grant 7,078,311 - Higashi , et al. July 18, 2	2006-07-18
Capacitor, capacitor-embedded board, and method for manufacturing the capacitor Grant 7,054,141 - Sakaguchi , et al. May 30, 2	2006-05-30
Terminal, semiconductor device, terminal forming method and flip chip semiconductor device manufacturing method Grant 7,019,405 - Koike , et al. March 28, 2	2006-03-28
Capacitor, circuit board with built-in capacitor and method of manufacturing the same Grant 6,980,416 - Sakaguchi , et al. December 27, 2	2005-12-27
Capacitor, capacitor-embedded board, and method for manufacturing the capacitor App 20050280978 - Sakaguchi, Hideaki ; et al.	2005-12-22
Capacitor, circuit board with built-in capacitor and method of manufacturing the same App 20050152098 - Sakaguchi, Hideaki ; et al.	2005-07-14
Capacitor, circuit board with built-in capacitor and method of manufacturing the same App 20050152097 - Sakaguchi, Hideaki ; et al.	2005-07-14
Substrate-embedded capacitor, production method thereof, and circuit board Grant 6,903,917 - Higashi , et al. June 7, 2	2005-06-07
Patterning apparatus and film patterning method App 20050098099 - Murayama, Kei ; et al.	2005-05-12
Semiconductor device having a carbon fiber reinforced resin as a heat radiation plate having a concave portion Grant 6,864,120 - Murayama , et al. March 8, 2	2005-03-08
Semiconductor device and production method thereof Grant 6,861,284 - Higashi , et al. March 1, 2	2005-03-01
Reference voltage generating device, semiconductor integrated circuit including the same, and testing device and method for semiconductor integrated circuit Grant 6,850,085 - Sakaguchi , et al. February 1, 2	2005-02-01
Semiconductor device and production method thereof App 20040262735 - Higashi, Mitsutoshi ; et al.	2004-12-30
Semiconductor testing apparatus and semiconductor testing method Grant 6,833,715 - Sakaguchi , et al. December 21, 2	2004-12-21
Patterning Apparatus And Film Patterning Method App 20040209004 - MURAYAMA, Kei ; et al.	2004-10-21
Semiconductor device and manufacturing method thereof App 20040178462 - Sakaguchi, Hideaki ; et al.	2004-09-16
Semiconductor device having a carbon fiber reinforced resin as a heat radiation plate having a concave portion App 20040166609 - Murayama, Kei ; et al.	2004-08-26
Method for dicing wafer App 20040142284 - Sakaguchi, Hideaki ; et al.	2004-07-22
Testing device and testing method for semiconductor integrated circuits Grant 6,766,266 - Sakaguchi July 20, 2	2004-07-20
Substrate-embedded capacitor, production method thereof, and circuit board App 20040137695 - Higashi, Mitsutoshi ; et al.	2004-07-15
Semiconductor device having a carbon fiber reinforced resin as a heat radiation plate having a concave portion Grant 6,713,863 - Murayama , et al. March 30, 2	2004-03-30
Semiconductor testing apparatus and semiconductor testing method App 20040008052 - Sakaguchi, Hideaki ; et al.	2004-01-15
Substrate-embedded capacitor, production method thereof, and circuit board App 20030223177 - Higashi, Mitsutoshi ; et al.	2003-12-04
Terminal, semiconductor device, terminal forming method and flip chip semiconductor device manufactrring method App 20030222326 - Koike, Hiroko ; et al.	2003-12-04
Reference voltage generating device, semiconductor integrated circuit including the same, and testing device and method for semiconductor integrated circuit App 20030201788 - Sakaguchi, Hideaki ; et al.	2003-10-30
Circuit board-providing article, circuit board, semiconductor device and process for the production of the same Grant 6,603,202 - Sasaki , et al. August 5, 2	2003-08-05
Method and apparatus for cutting a semiconductor wafer Grant 6,583,383 - Higashi , et al. June 24, 2	2003-06-24
Semiconductor Device Having External Connecting Terminals And Process For Manufacturing The Device App 20030107131 - HIGASHI, MITSUTOSHI ; et al.	2003-06-12
Semiconductor device and production method thereof App 20030102547 - Higashi, Mitsutoshi ; et al.	2003-06-05
Heat radiation fin using a carbon fiber reinforced resin as heat radiation plates standing on a substrate App 20030102117 - Murayama, Kei ; et al.	2003-06-05
Semiconductor device and process of producing same Grant 6,548,326 - Kobayashi , et al. April 15, 2	2003-04-15
Semiconductor device Grant 6,404,070 - Higashi , et al. June 11, 2	2002-06-11
Heat radiation fin using a carbon fiber reinforced resin as heat radiation plates standing on a substrate App 20020062946 - Murayama, Kei ; et al.	2002-05-30
Semiconductor device and process of producing same App 20020041037 - Kobayashi, Tsuyoshi ; et al.	2002-04-11
Method and apparatus for cutting a semiconductor wafer App 20010040152 - Higashi, Mitsutoshi ; et al.	2001-11-15
Semiconductor device having external connecting terminals and process for manufacturing the device App 20010028108 - Higashi, Mitsutoshi ; et al.	2001-10-11
Semiconductor device having a carbon fiber reinforced resin as a heat radiation plate having a concave portion App 20010009302 - Murayama, Kei ; et al.	2001-07-26
Circuit board-providing article, circuit board, semiconductor device and process for the production of the same App 20010006119 - Sasaki, Masayuki ; et al.	2001-07-05
Semiconductor device and production method thereof App 20010004130 - Higashi, Mitsutoshi ; et al.	2001-06-21
Method and apparatus for testing a driving circuit Grant 5,473,619 - Sakaguchi December 5, 1	1995-12-05

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