SAITOU; Mitsuhiro
Patent Applications and Registrations
Patent applications and USPTO patent grants for SAITOU; Mitsuhiro.The latest application filed is for "stacking apparatus and stacking method".
- SAITOU; Mitsuhiro - Saitama Saitama JP
- Saitou; Mitsuhiro - Obu JP
- Saitou; Mitsuhiro - Obu-city JP
- Saitou; Mitsuhiro - Ohu JP
- Saitou; Mitsuhiro - Oobu JP
- Saitou, Mitsuhiro - Oobu-shi JP
- Saitou; Mitsuhiro - Ohbu JP
| Patent | Date |
|---|---|
| Stacking Apparatus And Stacking Method App 20210245982 - KOBAYASHI; Yuko ; et al. | 2021-08-12 |
| Electronic control unit and method of manufacturing the same Grant 9,320,178 - Oota , et al. April 19, 2 | 2016-04-19 |
| Electronic Control Unit And Method Of Manufacturing The Same App 20130003306 - Oota; Shinsuke ; et al. | 2013-01-03 |
| Electronic Control Unit App 20120326292 - OHASHI; Yutaka ; et al. | 2012-12-27 |
| Semiconductor Device App 20120120610 - SAITOU; Mitsuhiro ; et al. | 2012-05-17 |
| Semiconductor device Grant 8,179,688 - Fukuda , et al. May 15, 2 | 2012-05-15 |
| Semiconductor device App 20110044009 - Fukuda; Yutaka ; et al. | 2011-02-24 |
| Semiconductor device Grant 7,843,700 - Fukuda , et al. November 30, 2 | 2010-11-30 |
| Electronic Control Unit And Method Of Manufacturing The Same App 20100254093 - Oota; Shinsuke ; et al. | 2010-10-07 |
| Electronic unit with a substrate where an electronic circuit is fabricated Grant 7,531,852 - Ueda , et al. May 12, 2 | 2009-05-12 |
| Driving apparatus of H bridge circuit and protection method of the same Grant 7,212,036 - Kasuya , et al. May 1, 2 | 2007-05-01 |
| Semiconductor device having metallic lead and electronic device having lead frame App 20070075419 - Fukuda; Yutaka ; et al. | 2007-04-05 |
| Electronic unit with a substrate where an electronic circuit is fabricated App 20050274982 - Ueda, Nobumasa ; et al. | 2005-12-15 |
| Semiconductor device and method for manufacturing the same App 20050231925 - Fukuda, Yutaka ; et al. | 2005-10-20 |
| Composite integrated circuit device having restricted heat conduction Grant 6,953,987 - Numazaki , et al. October 11, 2 | 2005-10-11 |
| Driving apparatus of H bridge circuit and protection method of the same App 20050179463 - Kasuya, Hirokazu ; et al. | 2005-08-18 |
| Power MOS transistor for absorbing surge current Grant 6,831,331 - Kitamura , et al. December 14, 2 | 2004-12-14 |
| Composite integrated circuit device App 20040145038 - Numazaki, Koji ; et al. | 2004-07-29 |
| Semiconductor device including bonded wire based to electronic part and method for manufacturing the same Grant 6,731,001 - Kinouchi , et al. May 4, 2 | 2004-05-04 |
| Semiconductor device including bonding wire bonded to electronic part and method for manufacturing the same App 20020020910 - Kinouchi, Kan ; et al. | 2002-02-21 |
| Semiconductor device and manufacturing method thereof App 20020017697 - Kitamura, Yasuhiro ; et al. | 2002-02-14 |
| Semiconductor device and manufacturing method thereof Grant 6,242,787 - Nakayama , et al. June 5, 2 | 2001-06-05 |
| Design for a semiconductor device having elements isolated by insulating regions Grant 6,104,078 - Iida , et al. August 15, 2 | 2000-08-15 |
| Semiconductor device having alignment mark Grant 6,081,040 - Okuda , et al. June 27, 2 | 2000-06-27 |
| Semiconductor wafer Grant 5,739,546 - Saitou , et al. April 14, 1 | 1998-04-14 |
| Method of producing thick multi-layer substrates Grant 5,593,722 - Otani , et al. January 14, 1 | 1997-01-14 |
| Ceramic multi-layer wiring board Grant 5,562,973 - Nagasaka , et al. October 8, 1 | 1996-10-08 |
| Ceramic multi-layer wiring board Grant 5,439,732 - Nagasaka , et al. August 8, 1 | 1995-08-08 |
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