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Patent applications and USPTO patent grants for Saito; Mutsuko.The latest application filed is for "electrolytic copper plating solution".
Patent | Date |
---|---|
Electrolytic Copper Plating Solution App 20160186348 - Mizuno; Yoko ;   et al. | 2016-06-30 |
Copper electroplating solution and method of copper electroplating Grant 9,175,413 - Saito , et al. November 3, 2 | 2015-11-03 |
Electrolytic copper plating solution and method of electrolytic copper plating Grant 9,169,576 - Saito , et al. October 27, 2 | 2015-10-27 |
Electrolytic copper plating liquid and the electrolytic copper plating method Grant 9,150,976 - Saito , et al. October 6, 2 | 2015-10-06 |
Copper Electroplating Solution And Method Of Copper Electroplating App 20140183052 - SAITO; Mutsuko ;   et al. | 2014-07-03 |
Electrolytic Copper Plating Liquid And The Electrolytic Copper Plating Method App 20140097087 - SAITO; Mutsuko ;   et al. | 2014-04-10 |
Electrolytic Copper Plating Solution And Method Of Electrolytic Copper Plating App 20130319867 - SAITO; Mutsuko ;   et al. | 2013-12-05 |
Tin Plating Solution App 20120132530 - HAYASHI; Shinjiro ;   et al. | 2012-05-31 |
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