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name:-0.002518892288208
name:-0.0017800331115723
name:-0.0005040168762207
Saito; Mutsuko Patent Filings

Saito; Mutsuko

Patent Applications and Registrations

Patent applications and USPTO patent grants for Saito; Mutsuko.The latest application filed is for "electrolytic copper plating solution".

Company Profile
0.3.5
  • Saito; Mutsuko - Niigata-shi JP
  • Saito; Mutsuko - Niigata JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Electrolytic Copper Plating Solution
App 20160186348 - Mizuno; Yoko ;   et al.
2016-06-30
Copper electroplating solution and method of copper electroplating
Grant 9,175,413 - Saito , et al. November 3, 2
2015-11-03
Electrolytic copper plating solution and method of electrolytic copper plating
Grant 9,169,576 - Saito , et al. October 27, 2
2015-10-27
Electrolytic copper plating liquid and the electrolytic copper plating method
Grant 9,150,976 - Saito , et al. October 6, 2
2015-10-06
Copper Electroplating Solution And Method Of Copper Electroplating
App 20140183052 - SAITO; Mutsuko ;   et al.
2014-07-03
Electrolytic Copper Plating Liquid And The Electrolytic Copper Plating Method
App 20140097087 - SAITO; Mutsuko ;   et al.
2014-04-10
Electrolytic Copper Plating Solution And Method Of Electrolytic Copper Plating
App 20130319867 - SAITO; Mutsuko ;   et al.
2013-12-05
Tin Plating Solution
App 20120132530 - HAYASHI; Shinjiro ;   et al.
2012-05-31

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