SAITO; Hirosuke

Patent Applications and Registrations

Patent applications and USPTO patent grants for SAITO; Hirosuke.The latest application filed is for "resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board".

Company Profile

4.8.13

SAITO; Hirosuke - Osaka JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Resin Composition, Prepreg, Film With Resin, Metal Foil With Resin, Metal-clad Laminate, And Wiring Board App 20220259424 - SAITO; Hirosuke ; et al.	2022-08-18
Resin Composition, Prepreg, Film With Resin, Metal Foil With Resin, Metal-clad Laminate, And Wiring Board App 20220259363 - SAITO; Hirosuke ; et al.	2022-08-18
Metal-clad Laminate, Metal Foil With Resin, And Wiring Board App 20210084757 - TSUDA; Kosuke ; et al.	2021-03-18
Polyphenylene ether resin composition, prepreg, metal-clad laminate and printed wiring board Grant 10,870,721 - Kitai , et al. December 22, 2	2020-12-22
Polyphenylene ether resin composition, prepreg, metal-clad laminate and printed wiring board Grant 10,590,223 - Kitai , et al.	2020-03-17
Resin Composition, Prepreg, Resin-coated Film, Resin-coated Metal Foil, Metal-clad Laminate, And Wiring Board App 20200001573 - SAITO; Hirosuke ; et al.	2020-01-02
Polyphenylene Ether Resin Composition, Prepreg, Metal-clad Laminate And Printed Wiring Board App 20190300639 - KITAI; Yuki ; et al.	2019-10-03
Method of curing thermosetting resin composition, thermosetting resin composition, and PREPREG, metal-clad laminate, resin sheet, printed-wiring board, and sealing material in which thermosetting resin composition is used Grant 10,047,213 - Fujiwara , et al. August 14, 2	2018-08-14
Curable Composition, Prepreg, Metal Foil With Composition, Metal-clad Laminate And Wiring Board App 20180170005 - SAITO; HIROSUKE ; et al.	2018-06-21
Curable Composition, Prepreg, Metal Foil With Resin, Metal-clad Laminate And Printed Wiring Board App 20170226302 - SAITO; HIROSUKE ; et al.	2017-08-10
Thermosetting resin composition, prepreg, metal clad laminate plate, and printed wiring board Grant 9,708,468 - Kitai , et al. July 18, 2	2017-07-18
Method Of Curing Thermosetting Resin Composition, Thermosetting Resin Composition, And Prepreg, Metal-clad Laminate, Resin Sheet, Printed-wiring Board, And Sealing Material In Which Thermosetting Resin Composition Is Used App 20170190875 - FUJIWARA; Hiroaki ; et al.	2017-07-06
Method of curing thermosetting resin composition, thermosetting resin composition, and prepreg, metal-clad laminate, resin sheet, printed-wiring board, and sealing material in which thermosetting resin composition is used Grant 9,637,598 - Fujiwara , et al. May 2, 2	2017-05-02
Resin composition, resin varnish, prepreg, metal-clad laminate and printed wiring board Grant 9,567,481 - Saito , et al. February 14, 2	2017-02-14
Resin composition, resin varnish, prepreg, metal-clad laminate, and printed wiring board Grant 9,528,026 - Sagara , et al. December 27, 2	2016-12-27
Polyphenylene Ether Resin Composition, Prepreg, Metal-clad Laminate And Printed Wiring Board App 20160145370 - KITAI; Yuki ; et al.	2016-05-26
Thermosetting Resin Composition, Prepreg, Metal Clad Laminate Plate, And Printed Wiring Board App 20160060429 - KITAI; YUKI ; et al.	2016-03-03
Resin Composition, Resin Varnish, Prepreg, Metal-clad Laminate And Printed Wiring Board App 20150376444 - SAITO; Hirosuke ; et al.	2015-12-31
Method Of Curing Thermosetting Resin Composition, Thermosetting Resin Composition, And Prepreg, Metal-clad Laminate, Resin Sheet, Printed-wiring Board, And Sealing Material In Which Thermosetting Resin Composition Is Used App 20150376338 - FUJIWARA; Hiroaki ; et al.	2015-12-31
Resin Composition, Resin Varnish, Prepreg, Metal-clad Laminate, And Printed Wiring Board App 20140182903 - Sagara; Takashi ; et al.	2014-07-03

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