Saisyo; Ryouta
Patent Applications and Registrations
Patent applications and USPTO patent grants for Saisyo; Ryouta.The latest application filed is for "cmp fluid and method for polishing palladium".
- Saisyo; Ryouta - Hitachi JP
- Saisyo; Ryouta - Ibaraki JP
| Patent | Date |
|---|---|
| CMP fluid and method for polishing palladium Grant 10,796,921 - Minami , et al. October 6, 2 | 2020-10-06 |
| Polishing solution for CMP, and method for polishing substrate using the polishing solution for CMP Grant 8,900,473 - Minami , et al. December 2, 2 | 2014-12-02 |
| CMP Fluid and Method for Polishing Palladium App 20120100718 - Minami; Hisataka ; et al. | 2012-04-26 |
| Polishing Solution For Cmp, And Method For Polishing Substrate Using The Polishing Solution For Cmp App 20110177690 - Minami; Hisataka ; et al. | 2011-07-21 |
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