SAINT-PATRICE; Damien

Patent Applications and Registrations

Patent applications and USPTO patent grants for SAINT-PATRICE; Damien.The latest application filed is for "electromechanical microsystem".

Company Profile

2.17.15

SAINT-PATRICE; Damien - Grenoble Cedex 09 FR
Saint-Patrice; Damien - Chabeuil FR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electromechanical Microsystem App 20220197014 - MOLLARD; Laurent ; et al.	2022-06-23
Electromechanical Microsystem App 20220197013 - MOLLARD; Laurent ; et al.	2022-06-23
RF/DC decoupling system for RF switches based on phase change material Grant 10,644,067 - Reig , et al.	2020-05-05
Packaging structure of a microelectronic device having a hermeticity improved by a diffusion barrier layer Grant 10,532,924 - Saint-Patrice , et al. Ja	2020-01-14
Switch including a phase change materials based structure where only one part is activatable Grant 10,529,515 - Navarro , et al. J	2020-01-07
Method of making a closed cavity comprising a flap protecting the cavity when it is closed Grant 10,414,648 - Reig , et al. Sept	2019-09-17
Rf/dc Decoupling System For Rf Switches Based On Phase Change Material App 20190088721 - REIG; Bruno ; et al.	2019-03-21
Commutator structure comprising several channels of phase change material and interdigitated control electrodes Grant 9,934,922 - Reig , et al. April 3, 2	2018-04-03
Method for packaging a microelectronic device in a hermetically sealed cavity and managing the atmosphere of the cavity with a dedicated hole Grant 9,908,773 - Saint-Patrice , et al. March 6, 2	2018-03-06
Switch Including A Phase Change Materials Based Structure Where Only One Part Is Activatable App 20180005786 - NAVARRO; Gabriele ; et al.	2018-01-04
Commutator Structure Comprising Several Channels Of Phase Change Material And Interdigitated Control Electrodes App 20170256377 - REIG; Bruno ; et al.	2017-09-07
Method Of Making A Closed Cavity Comprising A Flap Protecting The Cavity When It Is Closed App 20170183224 - REIG; Bruno ; et al.	2017-06-29
Microelectronic Package And Method Of Manufacturing A Microelectronic Package App 20170144883 - HENN; Gudrun ; et al.	2017-05-25
Packaging Structure Of A Microelectronic Device Having A Hermeticity Improved By A Diffusion Barrier Layer App 20170057809 - SAINT-PATRICE; Damien ; et al.	2017-03-02
Method of hermetically sealing a hole with a fuse material Grant 9,199,839 - Pornin , et al. December 1, 2	2015-12-01
Method Of Hermetically Sealing A Hole With A Fuse Material App 20150158725 - PORNIN; Jean-Louis ; et al.	2015-06-11
Method for metalizing blind vias Grant 9,003,654 - Jacquet , et al. April 14, 2	2015-04-14
Method of making a connection component with hollow inserts Grant 8,898,896 - Marion , et al. December 2, 2	2014-12-02
Interconnect structure with cavity having one or several contact rises on the wall of the cavity and method for producing same Grant 8,674,489 - Bolis , et al. March 18, 2	2014-03-18
Interconnect structure comprising blind vias intended to be metalized Grant 8,482,130 - Saint-Patrice , et al. July 9, 2	2013-07-09
Method for making a cavity in the thickness of a substrate which may form a site for receiving a component Grant 8,470,184 - Saint-Patrice , et al. June 25, 2	2013-06-25
Method For Making A Cavity In The Thickness Of A Substrate Which May Form A Site For Receiving A Component App 20120031874 - Saint-Patrice; Damien ; et al.	2012-02-09
Interconnect Structure Comprising Blind Vias Intended To Be Metalized App 20110221068 - SAINT-PATRICE; Damien ; et al.	2011-09-15
Method For Metalizing Blind Vias App 20110219612 - JACQUET; Fabrice ; et al.	2011-09-15
Connection Component With Hollow Inserts And Method For Making Same App 20110094789 - Marion; Francois ; et al.	2011-04-28
Interconnect Structure With Cavity Having One Or Several Contact Rises On The Wall Of The Cavity And Method For Producing Same App 20110097909 - BOLIS; Sebastien ; et al.	2011-04-28
Connection Component Provided With Inserts Comprising Compensating Blocks App 20110041332 - Saint-Patrice; Damien ; et al.	2011-02-24

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