Sain; Arghya
Patent Applications and Registrations
Patent applications and USPTO patent grants for Sain; Arghya.The latest application filed is for "microelectronic package with reduced through-substrate routing".
- Sain; Arghya - Chandler AZ
| Patent | Date |
|---|---|
| Microelectronic Package With Reduced Through-substrate Routing App 20210296241 - Sain; Arghya ; et al. | 2021-09-23 |
| Scalable High Speed High Bandwidth Io Signaling Package Architecture And Method Of Making App 20210028116 - GANESAN; Sanka ; et al. | 2021-01-28 |
| Package Design Scheme For Enabling High-speed Low-loss Signaling And Mitigation Of Manufacturing Risk And Cost App 20200343202 - WANG; Lijiang ; et al. | 2020-10-29 |
| Variable In-plane Signal To Ground Reference Configurations App 20200312759 - COLLINS; Andrew ; et al. | 2020-10-01 |
| Via architecture for increased density interface Grant 10,475,736 - Aleksov , et al. Nov | 2019-11-12 |
| Via Architecture For Increased Density Interface App 20190096798 - Aleksov; Aleksandar ; et al. | 2019-03-28 |
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