Saimoto; Yoshihisa

Patent Applications and Registrations

Patent applications and USPTO patent grants for Saimoto; Yoshihisa.The latest application filed is for "method of processing substrate".

Company Profile

0.7.10

Saimoto; Yoshihisa - Asan-si KR
Saimoto; Yoshihisa - Sagamihara N/A JP
Saimoto; Yoshihisa - Sagamihara-shi JP
Saimoto; Yoshihisa - Nagoya JP
Saimoto; Yoshihisa - Kawasaki-shi JP
Saimoto; Yoshihisa - Nagoya-shi JP
Saimoto; Yoshihisa - Minato-ku JP
Saimoto, Yoshihisa - Nagoya-shi Aichi JP
Saimoto; Yoshihisa - Aichi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method Of Processing Substrate App 20180337083 - Inada; Satoshi ; et al.	2018-11-22
Sheet for protecting surface of semiconductor wafer, semiconductor device manufacturing method and semiconductor wafer protection method using sheet Grant 8,476,740 - Hayashishita , et al. July 2, 2	2013-07-02
Sheet For Protecting Surface Of Semiconductor Wafer, Semiconductor Device Manufacturing Method And Semiconductor Wafer Protection Method Using Sheet App 20120273975 - Hayashishita; Eiji ; et al.	2012-11-01
Method of protecting semiconductor wafer and adhesive film for protection of semiconductor wafer Grant 7,501,312 - Koshimizu , et al. March 10, 2	2009-03-10
Semiconductor wafer surface protecting sheet and semiconductor wafer protecting method using such protecting sheet App 20080020575 - Saimoto; Yoshihisa ; et al.	2008-01-24
Adhesive film and method for forming metal film using same App 20070167003 - Saimoto; Yoshihisa ; et al.	2007-07-19
Pressure sensitive adhesive film for protection of semiconductor wafer surface and method of protecting semiconductor wafer with the pressure sensitive adhesive film Grant 7,238,421 - Saimoto , et al. July 3, 2	2007-07-03
Pressure-sensitive adhesive film for the surface protection of semiconductor wafers and method for protection of semiconductor wafers with the film Grant 7,201,969 - Miyakawa , et al. April 10, 2	2007-04-10
Pellicles having low adhesive residue App 20060257754 - Harubayashi; Katsuaki ; et al.	2006-11-16
Surface protecting film for semiconductor wafer and method of protecting semiconductor wafer using the same App 20050244631 - Sugimoto, Kosuke ; et al.	2005-11-03
Pressure sensitive adhesive film for protection of semiconductor wafer surface and method of protecting semiconductor wafer with the pressure sensitive adhesive film App 20050161774 - Saimoto, Yoshihisa ; et al.	2005-07-28
Method of protecting semiconductor wafer and adhesive film for protection of semiconductor wafer App 20050164509 - Koshimizu, Takanobu ; et al.	2005-07-28
Surface protecting adhesive film for semiconductor wafer and processing method for semiconductor wafer using said adhesive film Grant 6,879,026 - Fukumoto , et al. April 12, 2	2005-04-12
Protecting method for semiconductor wafer and surface protecting adhesive film for semiconductor wafer used in said method Grant 6,730,595 - Saimoto , et al. May 4, 2	2004-05-04
Surface protecting adhesive film for semiconductor wafer and protecting method for semiconductor wafer using said adhesive film App 20030064579 - Miyakawa, Masafumi ; et al.	2003-04-03
Protecting method for semiconductor wafer and surface protecting adhesive film for semiconductor wafer used said method App 20020106868 - Saimoto, Yoshihisa ; et al.	2002-08-08

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.