Saijo; Yoshikazu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Saijo; Yoshikazu.The latest application filed is for "method for producing printed wiring board".

Company Profile

5.13.15

Saijo; Yoshikazu - Osaka JP
Saijo; Yoshikazu - Hirakata N/A JP
SAIJO; Yoshikazu - Hirakata-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for producing a printed wiring board Grant 11,421,325 - Saijo , et al. August 23, 2	2022-08-23
Method For Producing Printed Wiring Board App 20210289637 - SAIJO; Yoshikazu ; et al.	2021-09-16
Pretreating liquid for electroless plating to be used during reduction treatment, and process for producing printed wiring board Grant 10,927,463 - Saijo , et al. February 23, 2	2021-02-23
Pretreating Liquid For Electroless Plating To Be Used During Reduction Treatment, And Process For Producing Printed Wiring Board App 20210047734 - SAIJO; Yoshikazu ; et al.	2021-02-18
Method For Producing A Printed Wiring Board App 20200378008 - SAIJO; Yoshikazu ; et al.	2020-12-03
Ultrasonic treatment apparatus Grant 10,773,280 - Yamamoto , et al. Sept	2020-09-15
Pretreating Liquid For Electroless Plating To Be Used During Reduction Treatment, And Process For Producing Printed Wiring Board App 20190264329 - SAIJO; Yoshikazu ; et al.	2019-08-29
Pretreatment agent for electroless plating, and pretreatment and production of printed wiring board using same Grant 10,138,558 - Saijo , et al. Nov	2018-11-27
Ultrasonic Treatment Apparatus App 20180133760 - YAMAMOTO; Hisamitsu ; et al.	2018-05-17
Pretreatment Agent For Electroless Plating, And Pretreatment And Production Of Printed Wiring Board Using Same App 20180023197 - SAIJO; Yoshikazu ; et al.	2018-01-25
Pretreatment agent for electroless plating, and pretreatment and production of printed wiring board using same Grant 9,374,913 - Saijo , et al. June 21, 2	2016-06-21
Electrolytic regeneration device Grant 9,045,836 - Saijo , et al. June 2, 2	2015-06-02
Pretreatment Agent For Electroless Plating, And Pretreatment And Production Of Printed Wiring Board Using Same App 20150072070 - SAIJO; Yoshikazu ; et al.	2015-03-12
Desmear Solution And Desmear Method App 20140339463 - Saijo; Yoshikazu ; et al.	2014-11-20
Electrolytic regeneration unit and electrolytic regeneration apparatus using same Grant 8,877,020 - Yamamoto , et al. November 4, 2	2014-11-04
Electrolytic Regeneration Unit And Electrolytic Regeneration Apparatus Using Same App 20120298505 - YAMAMOTO; Hisamitsu ; et al.	2012-11-29
Neutralizing/reducing Agent, And Desmear Method App 20120167916 - Saijo; Yoshikazu ; et al.	2012-07-05
Electrolytic Regeneration Device App 20120048728 - SAIJO; Yoshikazu ; et al.	2012-03-01
Electroless gold plating bath, electroless gold plating method and electronic parts Grant 7,988,773 - Kiso , et al. August 2, 2	2011-08-02
Electroless gold plating bath, electroless gold plating method and electronic parts Grant 7,985,285 - Kiso , et al. July 26, 2	2011-07-26
Electroless gold plating bath, electroless gold plating method and electronic parts App 20080138507 - Kiso; Masayuki ; et al.	2008-06-12
Electroless gold plating bath, electroless gold plating method and electronic parts App 20080138506 - Kiso; Masayuki ; et al.	2008-06-12
Process of forming catalyst nuclei on substrate, process of electroless-plating substrate, and modified zinc oxide film Grant 6,723,679 - Izaki , et al. April 20, 2	2004-04-20
Process of forming catalyst nuclei on substrate, process of electroless-plating substrate, and modified zinc oxide film App 20020187895 - Izaki, Masanobu ; et al.	2002-12-12
Process of forming catalyst nuclei on substrate, process of electroless-plating substrate, and modified zinc oxide film Grant 6,406,750 - Izaki , et al. June 18, 2	2002-06-18

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