Said; Roslan Bin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Said; Roslan Bin.The latest application filed is for "microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices".

Company Profile

1.10.10

Said; Roslan Bin - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices Grant 11,239,128 - Ye , et al. February 1, 2	2022-02-01
Microelectronic Devices, Stacked Microelectronic Devices, And Methods For Manufacturing Microelectronic Devices App 20190371693 - Ye; Seng Kim Dalson ; et al.	2019-12-05
Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices Grant 10,431,513 - Ye , et al. O	2019-10-01
Microelectronic Devices, Stacked Microelectronic Devices, And Methods For Manufacturing Microelectronic Devices App 20170301598 - Ye; Seng Kim Dalson ; et al.	2017-10-19
Microelectronic Devices, Stacked Microelectronic Devices, And Methods For Manufacturing Microelectronic Devices App 20150137364 - Ye; Seng Kim Dalson ; et al.	2015-05-21
Stacked microelectronic devices Grant 8,823,159 - Ye , et al. September 2, 2	2014-09-02
Microelectronic Devices, Stacked Microelectronic Devices, And Methods For Manufacturing Microelectronic Devices App 20130292853 - Ye; Seng Kim Dalson ; et al.	2013-11-07
Method for manufacturing microelectronic devices Grant 8,507,318 - Ye , et al. August 13, 2	2013-08-13
Stacked die package for peripheral and center device pad layout device Grant 8,269,328 - Kim , et al. September 18, 2	2012-09-18
Stacked Die Package For Peripheral And Center Device Pad Layout Device App 20110062583 - Kim; Dalson Ye Seng ; et al.	2011-03-17
Stacked die package for peripheral and center device pad layout device Grant 7,846,768 - Kim , et al. December 7, 2	2010-12-07
Microelectronic Devices, Stacked Microelectronic Devices, And Methods For Manufacturing Microelectronic Devices App 20090239337 - Ye; Seng Kim Dalson ; et al.	2009-09-24
Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices Grant 7,557,443 - Ye , et al. July 7, 2	2009-07-07
Stacked Die Package For Peripheral And Center Device Pad Layout Device App 20080280396 - Kim; Dalson Ye Seng ; et al.	2008-11-13
Stacked die package for peripheral and center device pad layout device Grant 7,425,463 - Kim , et al. September 16, 2	2008-09-16
Stacked device package for peripheral and center device pad layout device Grant 7,205,656 - Kim , et al. April 17, 2	2007-04-17
Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices App 20070045796 - Ye; Seng Kim Dalson ; et al.	2007-03-01
Stacked die package for peripheral and center device pad layout device App 20060246622 - Kim; Dalson Ye Seng ; et al.	2006-11-02
Stacked device package for peripheral and center device pad layout device App 20060197206 - Kim; Dalson Ye Seng ; et al.	2006-09-07

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