Saia; Richard Joseph
Patent Applications and Registrations
Patent applications and USPTO patent grants for Saia; Richard Joseph.The latest application filed is for "semiconductor device with junction termination extension".
Company Profile
3.35.22
- Saia; Richard Joseph - Niskayuna NY
- Saia; Richard Joseph - Schenectady NY
- Saia, Richard Joseph - Niskayana NY
Patent Activity
| Patent | Date |
|---|---|
| Tapered gate electrode for semiconductor devices Grant 10,903,330 - Saia , et al. January 26, 2 | 2021-01-26 |
| Stress resistant micro-via structure for flexible circuits Grant 10,276,486 - Gorczyca , et al. | 2019-04-30 |
| Semiconductor Device With Junction Termination Extension App 20160307997 - Arthur; Stephen Daley ; et al. | 2016-10-20 |
| Semiconductor device with junction termination extension Grant 9,406,762 - Arthur , et al. August 2, 2 | 2016-08-02 |
| Tapered Gate Electrode For Semiconductor Devices App 20150144960 - Saia; Richard Joseph ; et al. | 2015-05-28 |
| Semiconductor Device With Junction Termination Extension App 20150115284 - Arthur; Stephen Daley ; et al. | 2015-04-30 |
| Chip attach adhesive to facilitate embedded chip build up and related systems and methods Grant 8,604,612 - Saia , et al. December 10, 2 | 2013-12-10 |
| Interconnect structure Grant 8,498,131 - Fillion , et al. July 30, 2 | 2013-07-30 |
| Interconnect structure App 20110299821 - Fillion; Raymond Albert ; et al. | 2011-12-08 |
| Stress Resistant Micro-via Structure For Flexible Circuits App 20110215480 - Gorczyca; Thomas Bert ; et al. | 2011-09-08 |
| Apparatus and method for reducing pitch in an integrated circuit Grant 8,008,781 - Fillion , et al. August 30, 2 | 2011-08-30 |
| Electronic chip package with reduced contact pad pitch Grant 7,964,974 - Fillion , et al. June 21, 2 | 2011-06-21 |
| System and method of forming a wafer scale package Grant 7,952,187 - Kapusta , et al. May 31, 2 | 2011-05-31 |
| Method of making an ignition device Grant 7,785,482 - Subramanian , et al. August 31, 2 | 2010-08-31 |
| Chip Attach Adhesive To Facilitate Embedded Chip Build Up And Related Systems And Methods App 20100207261 - Saia; Richard Joseph ; et al. | 2010-08-19 |
| System and method of forming a low profile conformal shield Grant 7,752,751 - Kapusta , et al. July 13, 2 | 2010-07-13 |
| Apparatus And Method For Reducing Pitch In An Integrated Circuit App 20100133705 - Fillion; Raymond Albert ; et al. | 2010-06-03 |
| Apparatus And Method For Reducing Pitch In An Integrated Circuit App 20100132994 - Fillion; Raymond Albert ; et al. | 2010-06-03 |
| System And Method Of Forming A Low Profile Conformal Shield App 20090242263 - Kapusta; Christopher James ; et al. | 2009-10-01 |
| System And Method Of Forming A Wafer Scale Package App 20090243081 - Kapusta; Christopher James ; et al. | 2009-10-01 |
| Interconnect Structure App 20090028491 - Fillion; Raymond Albert ; et al. | 2009-01-29 |
| Method of making an ignition device App 20070125745 - Subramanian; Kanakasabapathi ; et al. | 2007-06-07 |
| Ignition device for a gas appliance and method of operation App 20070128563 - Subramanian; Kanakasabapathi ; et al. | 2007-06-07 |
| Semiconductor device and method of processing a semiconductor substrate App 20070015373 - Cowen; Christopher Steven ; et al. | 2007-01-18 |
| Control valve assembly for controlling gas flow in gas combustion systems App 20060057520 - Saia; Richard Joseph ; et al. | 2006-03-16 |
| Method of processing high-resolution flex circuits with low distortion Grant 6,994,897 - Durocher , et al. February 7, 2 | 2006-02-07 |
| Piezoelectric microvalve Grant 6,988,706 - Seeley , et al. January 24, 2 | 2006-01-24 |
| Optoelectronic package and fabrication method Grant 6,935,792 - Saia , et al. August 30, 2 | 2005-08-30 |
| Piezoelectric microvalve App 20050133751 - Seeley, Charles Erklin ; et al. | 2005-06-23 |
| Apparatus for aligning die to interconnect metal on flex substrate Grant 6,790,703 - Saia , et al. September 14, 2 | 2004-09-14 |
| Microelectromechanical system device packaging method Grant 6,773,962 - Saia , et al. August 10, 2 | 2004-08-10 |
| Microelectromechanical system device packaging method Grant 6,767,764 - Saia , et al. July 27, 2 | 2004-07-27 |
| Method of processing high-resolution flex circuits with low distortion App 20040094329 - Durocher, Kevin Matthew ; et al. | 2004-05-20 |
| Plastic packaging of LED arrays Grant 6,733,711 - Durocher , et al. May 11, 2 | 2004-05-11 |
| Plastic packaging of LED arrays Grant 6,730,533 - Durocher , et al. May 4, 2 | 2004-05-04 |
| Optoelectronic package and fabrication method App 20040076382 - Saia, Richard Joseph ; et al. | 2004-04-22 |
| Plastic packaging of LED arrays Grant 6,614,103 - Durocher , et al. September 2, 2 | 2003-09-02 |
| Plastic packaging of LED arrays App 20030160256 - Durocher, Kevin Matthew ; et al. | 2003-08-28 |
| Apparatus, method and product therefrom, for aligning die to interconnect metal on flex substrate App 20020197767 - Saia, Richard Joseph ; et al. | 2002-12-26 |
| Microelectromechanical system device package and packaging method App 20020173080 - Saia, Richard Joseph ; et al. | 2002-11-21 |
| Method for aligning die to interconnect metal on flex substrate Grant 6,475,877 - Saia , et al. November 5, 2 | 2002-11-05 |
| Microelectromechanical system device package and packaging method App 20020132391 - Saia, Richard Joseph ; et al. | 2002-09-19 |
| Method for fabricating a flexible interconnect film with resistor and capacitor layers Grant 6,323,096 - Saia , et al. November 27, 2 | 2001-11-27 |
| Amorphous hydrogenated carbon hermetic structure and fabrication method Grant 6,150,719 - Saia , et al. November 21, 2 | 2000-11-21 |
| Structure and method for molding optical disks Grant 6,146,558 - Feist , et al. November 14, 2 | 2000-11-14 |
| Structure for thin film capacitors Grant 5,973,908 - Saia , et al. October 26, 1 | 1999-10-26 |
| Flexible interconnect film including resistor and capacitor layers Grant 5,874,770 - Saia , et al. February 23, 1 | 1999-02-23 |
| Self-aligned transistor device including a patterned refracting dielectric layer Grant 5,814,859 - Ghezzo , et al. September 29, 1 | 1998-09-29 |
| Multilayer capacitors using amorphous hydrogenated carbon Grant 5,774,326 - McConnelee , et al. June 30, 1 | 1998-06-30 |
| Fabrication method for thin film capacitors Grant 5,736,448 - Saia , et al. April 7, 1 | 1998-04-07 |
| Silicon carbide MOSFET having self-aligned gate structure Grant 5,726,463 - Brown , et al. March 10, 1 | 1998-03-10 |
| Stacking of three dimensional high density interconnect modules with metal edge contacts Grant 5,699,234 - Saia , et al. December 16, 1 | 1997-12-16 |
| Method for fabricating a stack of two dimensional circuit modules Grant 5,657,537 - Saia , et al. August 19, 1 | 1997-08-19 |
| Method of micromachining electromagnetically actuated current switches with polyimide reinforcement seals, and switches produced thereby Grant 5,652,559 - Saia , et al. July 29, 1 | 1997-07-29 |
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