Sahoda; Tsuyoshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sahoda; Tsuyoshi.The latest application filed is for "light-emitting device assembly, method of producing the same, and display apparatus".

Company Profile

1.3.10

Sahoda; Tsuyoshi - Kagoshima JP
Sahoda; Tsuyoshi - Tokyo JP
Sahoda, Tsuyoshi - Chigasaki-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Light-emitting device assembly, method of producing the same, and display apparatus Grant 11,081,028 - Ohmae , et al. August 3, 2	2021-08-03
Light-emitting Device Assembly, Method Of Producing The Same, And Display Apparatus App 20200302835 - OHMAE; AKIRA ; et al.	2020-09-24
Copper Plating Bath and Plating Method App 20080264798 - NAKADA; Tsutomu ; et al.	2008-10-30
Method for processing substrate Grant 7,285,492 - Wang , et al. October 23, 2	2007-10-23
Substrate processing method and substrate processing apparatus App 20060234499 - Kodera; Akira ; et al.	2006-10-19
Plating apparatus and plating method App 20060081478 - Sahoda; Tsuyoshi ; et al.	2006-04-20
Method and apparatus for processing substrate App 20050245080 - Wang, Xinming ; et al.	2005-11-03
Method and apparatus for determining the concentrations of additives in a plating solution App 20050208201 - Kubota, Makoto ; et al.	2005-09-22
Plating method, plating apparatus and a method of forming fine circuit wiring App 20050126919 - Kubota, Makoto ; et al.	2005-06-16
Copper plating bath and plating method App 20050072683 - Nakada, Tsutomu ; et al.	2005-04-07
Plating method and plating solution App 20050045486 - Sahoda, Tsuyoshi ; et al.	2005-03-03
Copper plating bath and plating method for substrate using the copper plating bath Grant 6,800,188 - Hagiwara , et al. October 5, 2	2004-10-05
Copper plating bath and plating method for substrate using the copper plating bath App 20030106802 - Hagiwara, Hideki ; et al.	2003-06-12

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