loadpatents
name:-0.010899066925049
name:-0.0074341297149658
name:-0.0029737949371338
Sahasrabudhe; Shubhada H. Patent Filings

Sahasrabudhe; Shubhada H.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sahasrabudhe; Shubhada H..The latest application filed is for "methods of forming flexure based cooling solutions for package structures".

Company Profile
2.6.12
  • Sahasrabudhe; Shubhada H. - Gilbert AZ
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Methods of forming flexure based cooling solutions for package structures
Grant 11,276,625 - Kumar , et al. March 15, 2
2022-03-15
Methods Of Forming Flexure Based Cooling Solutions For Package Structures
App 20210280495 - Kumar; Siddarth ;   et al.
2021-09-09
Standoff Members For Semiconductor Package
App 20200066654 - CHANG; Je-Young ;   et al.
2020-02-27
Computing system with a thermal interface comprising magnetic particles
Grant 10,181,432 - Limaye , et al. Ja
2019-01-15
System and Method for Child Car Seat Safety Detection and Notification
App 20180354443 - Ebrahimi; Nona ;   et al.
2018-12-13
Computing System With A Thermal Interface Comprising Magnetic Particles
App 20180269128 - Limaye; Ameya ;   et al.
2018-09-20
Standoff Members For Semiconductor Package
App 20180190596 - Chang; Je-Young G. ;   et al.
2018-07-05
Warpage controlled package and method for same
Grant 9,953,934 - Kumar , et al. April 24, 2
2018-04-24
Warpage Controlled Package And Method For Same
App 20170178987 - Kumar; Siddarth ;   et al.
2017-06-22
Systems and methods for package on package through mold interconnects
Grant 9,659,908 - Sahasrabudhe , et al. May 23, 2
2017-05-23
Systems And Methods For Package On Package Through Mold Interconnects
App 20170133350 - Sahasrabudhe; Shubhada H. ;   et al.
2017-05-11
Contact pads for integrated circuit packages
Grant 9,368,461 - Albers , et al. June 14, 2
2016-06-14
Contact Pads For Integrated Circuit Packages
App 20150333022 - Albers; Sven ;   et al.
2015-11-19
Method, system, and apparatus for gravity assisted chip attachment
Grant 7,411,296 - Sahasrabudhe , et al. August 12, 2
2008-08-12
Method, system, and apparatus for gravity assisted chip attachment
App 20070212868 - Sahasrabudhe; Shubhada H. ;   et al.
2007-09-13

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