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Patent applications and USPTO patent grants for Sahasrabudhe; Shubhada H..The latest application filed is for "methods of forming flexure based cooling solutions for package structures".
Patent | Date |
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Methods of forming flexure based cooling solutions for package structures Grant 11,276,625 - Kumar , et al. March 15, 2 | 2022-03-15 |
Methods Of Forming Flexure Based Cooling Solutions For Package Structures App 20210280495 - Kumar; Siddarth ;   et al. | 2021-09-09 |
Standoff Members For Semiconductor Package App 20200066654 - CHANG; Je-Young ;   et al. | 2020-02-27 |
Computing system with a thermal interface comprising magnetic particles Grant 10,181,432 - Limaye , et al. Ja | 2019-01-15 |
System and Method for Child Car Seat Safety Detection and Notification App 20180354443 - Ebrahimi; Nona ;   et al. | 2018-12-13 |
Computing System With A Thermal Interface Comprising Magnetic Particles App 20180269128 - Limaye; Ameya ;   et al. | 2018-09-20 |
Standoff Members For Semiconductor Package App 20180190596 - Chang; Je-Young G. ;   et al. | 2018-07-05 |
Warpage controlled package and method for same Grant 9,953,934 - Kumar , et al. April 24, 2 | 2018-04-24 |
Warpage Controlled Package And Method For Same App 20170178987 - Kumar; Siddarth ;   et al. | 2017-06-22 |
Systems and methods for package on package through mold interconnects Grant 9,659,908 - Sahasrabudhe , et al. May 23, 2 | 2017-05-23 |
Systems And Methods For Package On Package Through Mold Interconnects App 20170133350 - Sahasrabudhe; Shubhada H. ;   et al. | 2017-05-11 |
Contact pads for integrated circuit packages Grant 9,368,461 - Albers , et al. June 14, 2 | 2016-06-14 |
Contact Pads For Integrated Circuit Packages App 20150333022 - Albers; Sven ;   et al. | 2015-11-19 |
Method, system, and apparatus for gravity assisted chip attachment Grant 7,411,296 - Sahasrabudhe , et al. August 12, 2 | 2008-08-12 |
Method, system, and apparatus for gravity assisted chip attachment App 20070212868 - Sahasrabudhe; Shubhada H. ;   et al. | 2007-09-13 |
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