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Semiconductor device having a back electrode including Au-Sb alloy layer and method of manufacturing the same Grant 11,217,670 - Takahashi , et al. January 4, 2 | 2022-01-04 |
Semiconductor Device And Method Of Manufacturing The Same App 20200203491 - TAKAHASHI; Yuji ;   et al. | 2020-06-25 |
Semiconductor device and a method of manufacturing the same Grant 10,199,338 - Kanaoka , et al. Fe | 2019-02-05 |
Semiconductor Device And A Method Of Manufacturing The Same App 20160284652 - KANAOKA; Taku ;   et al. | 2016-09-29 |
Semiconductor Device And A Method Of Manufacturing The Same App 20140159245 - KANAOKA; Taku ;   et al. | 2014-06-12 |
Semiconductor device and a method of manufacturing the same Grant 8,669,659 - Kanaoka , et al. March 11, 2 | 2014-03-11 |
Semiconductor Device And A Method Of Manufacturing The Same App 20120205788 - KANAOKA; TAKU ;   et al. | 2012-08-16 |
Semiconductor device with pads overlapping wiring layers including dummy wiring Grant 8,183,691 - Kanaoka , et al. May 22, 2 | 2012-05-22 |
Semiconductor Device And A Method Of Manufacturing The Same App 20100252924 - KANAOKA; TAKU ;   et al. | 2010-10-07 |
Semiconductor device and a method of manufacturing the same Grant 7,759,804 - Kanaoka , et al. July 20, 2 | 2010-07-20 |
Semiconductor device and a method of manufacturing the same Grant 7,750,427 - Watanabe , et al. July 6, 2 | 2010-07-06 |
Semiconductor device and a method of manufacturing the same Grant 7,705,462 - Uchikoshi , et al. April 27, 2 | 2010-04-27 |
Semiconductor device and a method of manufacturing the same Grant 7,615,848 - Uchikoshi , et al. November 10, 2 | 2009-11-10 |
Semiconductor Device And A Method Of Manufacturing The Same App 20090152644 - WATANABE; Kozo ;   et al. | 2009-06-18 |
Semiconductor device and a method of manufacturing the same Grant 7,504,297 - Watanabe , et al. March 17, 2 | 2009-03-17 |
Semiconductor Device And A Method Of Manufacturing The Same App 20080277794 - Uchikoshi; Ken ;   et al. | 2008-11-13 |
Semiconductor device with guard rings that are formed in each of the plural wiring layers Grant 7,400,046 - Uchikoshi , et al. July 15, 2 | 2008-07-15 |
Semiconductor Device And A Method Of Manufacturing The Same App 20080122085 - Kanaoka; Taku ;   et al. | 2008-05-29 |
Semiconductor device and a method of manufacturing the same Grant 7,342,302 - Kanaoka , et al. March 11, 2 | 2008-03-11 |
Semiconductor device and a method of manufacturing the same Grant 7,303,986 - Uchikoshi , et al. December 4, 2 | 2007-12-04 |
Semiconductor device and a method of manufacturing the same App 20070246780 - Watanabe; Kozo ;   et al. | 2007-10-25 |
Semiconductor device and a method of manufacturing the same App 20070228574 - Uchikoshi; Ken ;   et al. | 2007-10-04 |
Semiconductor device and method of manufacturing the same Grant 7,241,685 - Moriya , et al. July 10, 2 | 2007-07-10 |
Semiconductor device and a method of manufacturing the same App 20070066050 - Uchikoshi; Ken ;   et al. | 2007-03-22 |
Method of manufacturing a semiconductor device having a multi-layered wiring structure Grant 7,189,637 - Uchikoshi , et al. March 13, 2 | 2007-03-13 |
Semiconductor Device and a Method of Manufacturing the Same App 20060289998 - Kanaoka; Taku ;   et al. | 2006-12-28 |
Semiconductor integrated circuit device and the process of the same Grant 7,132,341 - Sahara , et al. November 7, 2 | 2006-11-07 |
Semiconductor device and a method of manufacturing the same Grant 7,102,223 - Kanaoka , et al. September 5, 2 | 2006-09-05 |
Semiconductor device having aluminum conductors Grant 7,064,437 - Iwasaki , et al. June 20, 2 | 2006-06-20 |
Semiconductor device and method of manufacturing same Grant 6,897,570 - Nakajima , et al. May 24, 2 | 2005-05-24 |
Semiconductor device having aluminum alloy conductors Grant 6,856,021 - Iwasaki , et al. February 15, 2 | 2005-02-15 |
Semiconductor integrated circuit device and method for making the same App 20040235289 - Suzuki, Masayuki ;   et al. | 2004-11-25 |
Semiconductor device having a capacitor and a metal interconnect layer with tungsten as a main constituent material and containing molybdenum Grant 6,784,549 - Iwasaki , et al. August 31, 2 | 2004-08-31 |
Semiconductor integrated circuit device and method for making the same Grant 6,780,757 - Suzuki , et al. August 24, 2 | 2004-08-24 |
Semiconductor device and a method of manufacturing the same App 20040121571 - Uchikoshi, Ken ;   et al. | 2004-06-24 |
Semiconductor device and method of manufacturing same App 20030230809 - Nakajima, Takashi ;   et al. | 2003-12-18 |
Semiconductor Integrated Circuit Device And Method For Making The Same App 20030199161 - Suzuki, Masayuki ;   et al. | 2003-10-23 |
Semiconductor device and method of manufacturing the same App 20030170980 - Moriya, Hiroshi ;   et al. | 2003-09-11 |
Semiconductor device Grant 6,617,691 - Nakajima , et al. September 9, 2 | 2003-09-09 |
Semiconductor device having a capacitor and a metal interconnect layer with tungsten as a main constituent material and containing molybdenum App 20030160267 - Iwasaki, Tomio ;   et al. | 2003-08-28 |
Semiconductor device having a capacitor and a metal interconnect layer with tungsten as a main constituent material and containing molybdenum App 20030020167 - Iwasaki, Tomio ;   et al. | 2003-01-30 |
Semiconductor device App 20030015801 - Nakajima, Takashi ;   et al. | 2003-01-23 |
Semiconductor integrated circuit device and the process of manufacturing the same App 20020190295 - Suzuki, Masayuki ;   et al. | 2002-12-19 |
Semiconductor device having aluminum conductors App 20020167091 - Iwasaki, Tomio ;   et al. | 2002-11-14 |
Semiconductor integrated circuit device and method for making the same App 20020115281 - Suzuki, Masayuki ;   et al. | 2002-08-22 |
Semiconductor integrated circuit device and the process of the same App 20020048947 - Sahara, Masashi ;   et al. | 2002-04-25 |
Semiconductor device and method of manufacturing the same App 20020036350 - Moriya, Hiroshi ;   et al. | 2002-03-28 |
Semiconductor device App 20020024140 - Nakajima, Takashi ;   et al. | 2002-02-28 |
Semiconductor integrated circuit device and method for making the same App 20020019124 - Suzuki, Masayuki ;   et al. | 2002-02-14 |
Semiconductor integrated circuit device and the process of manufacturing the same App 20010050386 - Suzuki, Masayuki ;   et al. | 2001-12-13 |
Semiconductor integrated circuit device for connecting semiconductor region and electrical wiring metal via titanium silicide layer and method of fabrication thereof App 20010023958 - Todorobaru, Hiromi ;   et al. | 2001-09-27 |
Semiconductor integrated circuit device for connecting semiconductor region and electrical wiring metal via titanium silicide layer and method of fabrication thereof Grant 6,031,288 - Todorobaru , et al. February 29, 2 | 2000-02-29 |
Method for making semiconductor integrated circuit device having interconnection structure using tungsten film Grant 5,904,556 - Suzuki , et al. May 18, 1 | 1999-05-18 |