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Patent applications and USPTO patent grants for Sahakian; Diane.The latest application filed is for "leadframe-based mold array package heat spreader and fabrication method therefor".
Patent | Date |
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Leadframe-based mold array package heat spreader and fabrication method therefor Grant 8,581,375 - Ramakrishna , et al. November 12, 2 | 2013-11-12 |
Leadframe-based Mold Array Package Heat Spreader And Fabrication Method Therefor App 20120241929 - Ramakrishna; Kambhampati ;   et al. | 2012-09-27 |
Leadframe-based mold array package heat spreader and fabrication method therefor Grant 8,211,753 - Ramakrishna , et al. July 3, 2 | 2012-07-03 |
Array-molded package heat spreader and fabrication method therefor Grant 7,863,730 - Shim , et al. January 4, 2 | 2011-01-04 |
Pre-molded leadframe and method therefor Grant 7,399,658 - Shim , et al. July 15, 2 | 2008-07-15 |
Pre-molded Leadframe And Method Therefor App 20070111379 - Shim; Il Kwon ;   et al. | 2007-05-17 |
Pre-molded Leadframe And Method Therefor App 20070093000 - Shim; Il Kwon ;   et al. | 2007-04-26 |
Packaging for optoelectronic devices Grant 7,091,469 - Kossives , et al. August 15, 2 | 2006-08-15 |
Packaging for optoelectronic devices App 20050258216 - Kossives, Dean Paul ;   et al. | 2005-11-24 |
Array-molded package heat spreader and fabrication method therefor App 20050046015 - Shim, Il Kwon ;   et al. | 2005-03-03 |
Leadframe-based mold array package heat spreader and fabrication method therefor App 20050046012 - Ramakrishna, Kambhampati ;   et al. | 2005-03-03 |
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