Saha; Bijay S.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Saha; Bijay S..The latest application filed is for "reducing underfill keep out zone on substrate used in electronic device processing".

Company Profile

0.9.3

Saha; Bijay S. - Chandler AZ US
Saha; Bijay S. - Rochester NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Reducing underfill keep out zone on substrate used in electronic device processing Grant 8,362,627 - Gokhale , et al. January 29, 2	2013-01-29
Reducing Underfill Keep Out Zone On Substrate Used In Electronic Device Processing App 20110084388 - GOKHALE; Shripad ; et al.	2011-04-14
Reducing underfill keep out zone on substrate used in electronic device processing Grant 7,875,503 - Gokhale , et al. January 25, 2	2011-01-25
Method of substrate manufacture that decreases the package resistance Grant 7,432,202 - Saha , et al. October 7, 2	2008-10-07
Reducing Underfill Keep Out Zone On Substrate Used In Electronic Device Processing App 20080157352 - Gokhale; Shripad ; et al.	2008-07-03
Method of substrate manufacture that decreases the package resistance App 20070148971 - Saha; Bijay S. ; et al.	2007-06-28
Low dusting carriers Grant 5,332,645 - Saha , et al. July 26, 1	1994-07-26
Device for developing an electrostatic image on an image member Grant 5,325,161 - Saha , et al. June 28, 1	1994-06-28
Interdispersed three-phase ferrite composite and electrographic magnetic carrier particles therefrom Grant 5,104,761 - Saha , et al. April 14, 1	1992-04-14
Glass composite magnetic carrier particles Grant 5,061,586 - Saha , et al. October 29, 1	1991-10-29
Rare earth containing magnetic carrier particles Grant 4,855,206 - Saha August 8, 1	1989-08-08

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