Saha; Amitesh
Patent Applications and Registrations
Patent applications and USPTO patent grants for Saha; Amitesh.The latest application filed is for "channeled lids for integrated circuit packages".
- Saha; Amitesh - Phoenix AZ
- Saha; Amitesh - Milwaukee WI
| Patent | Date |
|---|---|
| Channeled Lids For Integrated Circuit Packages App 20200395269 - Dubey; Manish ; et al. | 2020-12-17 |
| Lids For Integrated Circuit Packages With Solder Thermal Interface Materials App 20200388554 - Falola; Bamidele Daniel ; et al. | 2020-12-10 |
| Integrated Circuit Packages With Solder Thermal Interface Materials With Embedded Particles App 20200381332 - Saha; Amitesh ; et al. | 2020-12-03 |
| Integrated Circuit Packages With Thermal Interface Materials With Different Material Compositions App 20200373220 - Chan Arguedas; Sergio Antonio ; et al. | 2020-11-26 |
| Solder Thermal Interface Material (stim) With Dopant App 20200357764 - Das Mahapatra; Susmriti ; et al. | 2020-11-12 |
| Thermal Management Solutions Using Self-healing Polymeric Thermal Interface Materials App 20200294886 - Saha; Amitesh ; et al. | 2020-09-17 |
| Thermal Management Solutions For Integrated Circuit Packages App 20200260609 - A1 | 2020-08-13 |
| Latex Ink Receptive Coating App 20190210391 - Saha; Amitesh | 2019-07-11 |
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