Sagisaka; Katsumi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sagisaka; Katsumi.The latest application filed is for "flex-rigid wiring board and electronic device".

Company Profile

0.7.4

Sagisaka; Katsumi - Ogaki JP
Sagisaka; Katsumi - Gifu JP
Sagisaka; Katsumi - Ogaki-shi JP
Sagisaka; Katsumi - Ohgaki JP
Sagisaka; Katsumi - Oogaki City JP
Sagisaka; Katsumi - Oogaki JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Flex-rigid wiring board and electronic device Grant 8,238,109 - Sagisaka August 7, 2	2012-08-07
Flex-rigid wiring board and manufacturing method thereof Grant 8,093,502 - Mikado , et al. January 10, 2	2012-01-10
Flex-rigid Wiring Board And Electronic Device App 20100051326 - Sagisaka; Katsumi	2010-03-04
Flex-rigid Wiring Board And Electronic Device App 20100014265 - SAGISAKA; Katsumi	2010-01-21
Flex-Rigid Wiring Board and Manufacturing Method Thereof App 20080289859 - Mikado; Yukinobu ; et al.	2008-11-27
Multi-piece substrate and method of manufacturing the substrate Grant 6,727,591 - Yanase , et al. April 27, 2	2004-04-27
Multi-piece substrate and method of manufacturing the substrate App 20030178725 - Yanase, Makoto ; et al.	2003-09-25
Electronic component carriers and method of producing the same as well as electronic devices Grant 5,438,478 - Kondo , et al. August 1, 1	1995-08-01
Semiconductor devices Grant 5,394,298 - Sagisaka February 28, 1	1995-02-28
Circuit board for mounting electronic components Grant 4,949,225 - Sagisaka , et al. August 14, 1	1990-08-14
Method of manufacturing a substrate for mounting electronic components Grant 4,908,933 - Sagisaka , et al. March 20, 1	1990-03-20

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