Sagara; Junya

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sagara; Junya.The latest application filed is for "method for manufacturing a stacked semiconductor package, and stacked semiconductor package".

Company Profile

0.7.12

Sagara; Junya - Kawasaki JP
Sagara; Junya - Kawasaki-shi JP
Sagara; Junya - Kanagawa-ken JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device and adhesive sheet Grant 8,294,282 - Hayashi , et al. October 23, 2	2012-10-23
Wire bonding apparatus and wire bonding method Grant 8,231,046 - Nakao , et al. July 31, 2	2012-07-31
Method For Manufacturing A Stacked Semiconductor Package, And Stacked Semiconductor Package App 20110163459 - Sagara; Junya ; et al.	2011-07-07
Method for manufacturing a stacked semiconductor package, and stacked semiconductor package Grant 7,932,162 - Sagara , et al. April 26, 2	2011-04-26
Semiconductor Device And Adhesive Sheet App 20110068480 - Hayashi; Hidekazu ; et al.	2011-03-24
Semiconductor device having semiconductor chips stacked and mounted thereon and manufacturing method thereof Grant 7,892,890 - Kurosawa , et al. February 22, 2	2011-02-22
Apparatus and method for manufacturing semiconductor device Grant 7,849,897 - Omizo , et al. December 14, 2	2010-12-14
Manufacturing Method Of Semiconductor Device App 20100311224 - Kurosawa; Tetsuya ; et al.	2010-12-09
Wire Bonding Apparatus And Wire Bonding Method App 20100181367 - Nakao; Mitsuhiro ; et al.	2010-07-22
Semiconductor Device Having Semiconductor Chips Stacked And Mounted Thereon And Manufacturing Method Thereof App 20100112755 - Kurosawa; Tetsuya ; et al.	2010-05-06
Semiconductor device having semiconductor chips stacked and mounted thereon and manufacturing method thereof Grant 7,675,153 - Kurosawa , et al. March 9, 2	2010-03-09
Semiconductor device and manufacturing method thereof Grant 7,569,921 - Okane , et al. August 4, 2	2009-08-04
Method For Manufacturing A Stacked Semiconductor Package, And Stacked Semiconductor Package App 20090096110 - SAGARA; Junya ; et al.	2009-04-16
Apparatus and method for manufacturing semiconductor device App 20080110546 - Omizo; Shoko ; et al.	2008-05-15
Wire Bonding Apparatus And Wire Bonding Method App 20080099532 - Nakao; Mitsuhiro ; et al.	2008-05-01
Semiconductor package and manufacturing method thereof App 20070023875 - Okane; Noboru ; et al.	2007-02-01
Semiconductor package App 20070023922 - Okane; Noboru ; et al.	2007-02-01
Semiconductor device and manufacturing method thereof App 20060232288 - Okane; Noboru ; et al.	2006-10-19
Semiconductor device having semiconductor chips stacked and mounted thereon and manufacturing method thereof App 20060175697 - Kurosawa; Tetsuya ; et al.	2006-08-10

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