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Patent applications and USPTO patent grants for Sagal; Mikhail.The latest application filed is for "in mold electronic printed circuit board encapsulation and assembly".
Patent | Date |
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In mold electronic printed circuit board encapsulation and assembly Grant 11,112,103 - Davis , et al. September 7, 2 | 2021-09-07 |
In Mold Electronic Printed Circuit Board Encapsulation And Assembly App 20190093874 - Davis; Terry G. ;   et al. | 2019-03-28 |
In mold electronic printed circuit board encapsulation and assembly Grant 10,156,352 - Davis , et al. Dec | 2018-12-18 |
In Mold Electronic Printed Circuit Board Encapsulation And Assembly App 20160084490 - DAVIS; Terry G. ;   et al. | 2016-03-24 |
Thermally Conductive Thermoplastic Compositions App 20120319031 - Li; Xiangyang ;   et al. | 2012-12-20 |
Method Of Forming A Highly Thermally Conductive And High Strength Article App 20040106702 - McCullough, Kevin A. ;   et al. | 2004-06-03 |
Polymer composition with metal coated carbon flakes Grant 6,503,964 - Smith , et al. January 7, 2 | 2003-01-07 |
Injection moldable elastomeric gasket App 20020014748 - McCullough, Kevin A. ;   et al. | 2002-02-07 |
Polymer composition with metal coated carbon flakes App 20010025075 - Smith, Lyle James ;   et al. | 2001-09-27 |
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