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Patent applications and USPTO patent grants for Saga Cizek; Rizza Lee.The latest application filed is for "off substrate kinking of bond wire".
Patent | Date |
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Off substrate kinking of bond wire Grant 9,893,033 - Haba , et al. February 13, 2 | 2018-02-13 |
Wire bond support structure and microelectronic package including wire bonds therefrom Grant 9,412,714 - Co , et al. August 9, 2 | 2016-08-09 |
Off Substrate Kinking Of Bond Wire App 20160225739 - Haba; Belgacem ;   et al. | 2016-08-04 |
Wire Bond Support Structure And Microelectronic Package Including Wire Bonds Therefrom App 20150348928 - Co; Reynaldo ;   et al. | 2015-12-03 |
Severing bond wire by kinking and twisting Grant 9,082,753 - Haba , et al. July 14, 2 | 2015-07-14 |
Severing Bond Wire By Kinking And Twisting App 20150129647 - Haba; Belgacem ;   et al. | 2015-05-14 |
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