Saga Cizek; Rizza Lee
Patent Applications and Registrations
Patent applications and USPTO patent grants for Saga Cizek; Rizza Lee.The latest application filed is for "off substrate kinking of bond wire".
- Saga Cizek; Rizza Lee - Brentwood CA
| Patent | Date |
|---|---|
| Off substrate kinking of bond wire Grant 9,893,033 - Haba , et al. February 13, 2 | 2018-02-13 |
| Wire bond support structure and microelectronic package including wire bonds therefrom Grant 9,412,714 - Co , et al. August 9, 2 | 2016-08-09 |
| Off Substrate Kinking Of Bond Wire App 20160225739 - Haba; Belgacem ; et al. | 2016-08-04 |
| Wire Bond Support Structure And Microelectronic Package Including Wire Bonds Therefrom App 20150348928 - Co; Reynaldo ; et al. | 2015-12-03 |
| Severing bond wire by kinking and twisting Grant 9,082,753 - Haba , et al. July 14, 2 | 2015-07-14 |
| Severing Bond Wire By Kinking And Twisting App 20150129647 - Haba; Belgacem ; et al. | 2015-05-14 |
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