Saeki; Keiji
Patent Applications and Registrations
Patent applications and USPTO patent grants for Saeki; Keiji.The latest application filed is for "method of mounting a semiconductor chip on a wiring substrate".
- Saeki; Keiji - Kobe JP
- Saeki; Keiji - Hyogo JP
- Saeki; Keiji - Osaka JP
| Patent | Date |
|---|---|
| Method of mounting a semiconductor chip on a wiring substrate Grant 5,813,115 - Misawa , et al. September 29, 1 | 1998-09-29 |
| Method of packaging electronic chip component and method of bonding of electrode thereof Grant 5,744,382 - Kitayama , et al. April 28, 1 | 1998-04-28 |
| IC component mounting method and apparatus Grant 5,667,129 - Morita , et al. September 16, 1 | 1997-09-16 |
| Semiconductor device and method of manufacturing the same Grant 5,622,590 - Kunitomo , et al. April 22, 1 | 1997-04-22 |
| Semiconductor device and method of manufacturing the same Grant 5,436,503 - Kunitomo , et al. July 25, 1 | 1995-07-25 |
| Method for bonding lead of IC component with electrode Grant 5,240,170 - Nishida , et al. August 31, 1 | 1993-08-31 |
| Method and apparatus for drawing thick film circuit Grant 4,743,465 - Saeki , et al. May 10, 1 | 1988-05-10 |
| Method and apparatus for drawing a thick film circuit Grant 4,692,351 - Maeda , et al. September 8, 1 | 1987-09-08 |
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