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Patent applications and USPTO patent grants for Sada; Hiroyuki.The latest application filed is for "display device".
Patent | Date |
---|---|
Integrated circuit backside metallization Grant 11,367,699 - Sada , et al. June 21, 2 | 2022-06-21 |
Die matrix expander with partitioned subring Grant 11,171,031 - Sherbin , et al. November 9, 2 | 2021-11-09 |
Display Device App 20210215965 - ISOBE; HIROAKI ;   et al. | 2021-07-15 |
Integrated Circuit Backside Metallization App 20210035932 - SADA; Hiroyuki ;   et al. | 2021-02-04 |
Integrated circuit backside metallization Grant 10,763,230 - Sada , et al. Sep | 2020-09-01 |
Quad Flat No Lead Package And Method Of Making App 20200251352 - Kind Code | 2020-08-06 |
Integrated Circuit Backside Metallization App 20200203295 - SADA; Hiroyuki ;   et al. | 2020-06-25 |
Front Side Laser-based Wafer Dicing App 20200176314 - SHERBIN; MATTHEW JOHN ;   et al. | 2020-06-04 |
Quad flat no lead package and method of making Grant 10,665,475 - Okamoto , et al. | 2020-05-26 |
Semiconductor die singulation Grant 10,658,240 - Iriguchi , et al. | 2020-05-19 |
Die Matrix Expander With Partitioned Subring App 20200027772 - SHERBIN; MATTHEW JOHN ;   et al. | 2020-01-23 |
Stern tube sealing device Grant 9,868,502 - Saito , et al. January 16, 2 | 2018-01-16 |
Quad Flat No Lead Package And Method Of Making App 20150364373 - Okamoto; Dan ;   et al. | 2015-12-17 |
Stern Tube Sealing Device App 20150137458 - Saito; Kenichi ;   et al. | 2015-05-21 |
Actuation controller for air bag device Grant 6,330,500 - Moriyama , et al. December 11, 2 | 2001-12-11 |
Collision detection device Grant 5,900,807 - Moriyama , et al. May 4, 1 | 1999-05-04 |
Crash sensor Grant 5,777,225 - Sada , et al. July 7, 1 | 1998-07-07 |
Crash sensor Grant 5,396,424 - Moriyama , et al. * March 7, 1 | 1995-03-07 |
Shock sensor Grant 5,326,945 - Gotoh , et al. July 5, 1 | 1994-07-05 |
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