| Patent | Date |
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Enhanced thermo-oxidative stability thermal interface compositions and use thereof in microelectronics assembly
Grant 7,964,542 - Sachdev , et al. June 21, 2 | 2011-06-21 |
Polyimide compositions and use thereof in ceramic product defect repair
Grant 7,608,295 - Sachdev , et al. October 27, 2 | 2009-10-27 |
Conductive adhesive composition
Grant 7,405,247 - Sachdev , et al. July 29, 2 | 2008-07-29 |
Conductive adhesive rework method
Grant 7,393,419 - Sachdev , et al. July 1, 2 | 2008-07-01 |
UV-curable solvent free compositions and use thereof in ceramic chip defect repair
Grant 7,329,439 - Sachdev , et al. February 12, 2 | 2008-02-12 |
Conductive Adhesive Rework Method
App 20080017223 - Sachdev; Krishna G. ; et al. | 2008-01-24 |
Thermal interface adhesive and rework
Grant 7,312,261 - Sachdev , et al. December 25, 2 | 2007-12-25 |
Conductive Adhesive Composition
App 20070270536 - Sachdev; Krishna G. ; et al. | 2007-11-22 |
Enhanced thermo-oxidative stability thermal interface compositions and use thereof in microelectronics assembly
App 20070161521 - Sachdev; Krishna G. ; et al. | 2007-07-12 |
Polyimide Compositions And Use Thereof In Ceramic Product Defect Repair
App 20070154631 - Sachdev; Krishna G. ; et al. | 2007-07-05 |
UV-curable solvent free compositions and use thereof in ceramic chip defect repair
App 20060069177 - Sachdev; Krishna G. ; et al. | 2006-03-30 |
Thermal Interface Adhesive And Rework
App 20050256241 - Sachdev, Krishna G. ; et al. | 2005-11-17 |
Semi-aqueous solvent based method of cleaning rosin flux residue
Grant 6,800,141 - Sachdev , et al. October 5, 2 | 2004-10-05 |
Polyimide compositions and use thereof in ceramic product defect repair
App 20040132900 - Sachdev, Krishna G. ; et al. | 2004-07-08 |
Semi-aqueous solvent cleaning of paste processing residue from substrates
Grant 6,742,530 - Sachdev , et al. June 1, 2 | 2004-06-01 |
UV-curable compositions and method of use thereof in microelectronics
Grant 6,682,872 - Sachdev , et al. January 27, 2 | 2004-01-27 |
Method of removing silicone polymer deposits from electronic components
Grant 6,652,665 - Sachdev , et al. November 25, 2 | 2003-11-25 |
UV-curable compositions and method of use thereof in microelectronics
App 20030138733 - Sachdev, Krishna G. ; et al. | 2003-07-24 |
Method of forming defect-free ceramic structures using thermally depolymerizable surface layer
Grant 6,597,058 - Natarajan , et al. July 22, 2 | 2003-07-22 |
Semi-aqueous solvent based method of cleaning rosin flux residue
App 20030121529 - Sachdev, Krishna G. ; et al. | 2003-07-03 |
Process for electrolytically cleaning paste from a workpiece
App 20030116173 - Humenik, James N, ; et al. | 2003-06-26 |
Epoxy-siloxanes based electrically conductive adhesives for semiconductor assembly and process for use thereof
Grant 6,548,175 - Sachdev , et al. April 15, 2 | 2003-04-15 |
Semi-aqueous solvent cleaning of paste processing residue from substrates
App 20030066540 - Sachdev, Krishna G. ; et al. | 2003-04-10 |
Polymer and ceramic composite electronic substrates
Grant 6,528,145 - Berger , et al. March 4, 2 | 2003-03-04 |
Epoxy-siloxanes based electrically conductive adhesives for semiconductor assembly and process for use thereof
App 20020127406 - Sachdev, Krishna G. ; et al. | 2002-09-12 |
Cleaning method to remove flux residue in electronic assembly
App 20020094940 - Sachdev, Krishna G. ; et al. | 2002-07-18 |
Multi-thickness, multi-layer green sheet lamination and method thereof
Grant 6,406,778 - Natarajan , et al. June 18, 2 | 2002-06-18 |
Polycarboxylates-based aqueous compositions for cleaning of screening apparatus
App 20020072482 - Sachdev, Krishna G. ; et al. | 2002-06-13 |
Removal Of Cured Silicone Adhesive For Reworking Electronic Components
App 20020000239 - SACHDEV, KRISHNA G. ; et al. | 2002-01-03 |
Removal Of Screening Paste Residue With Quaternary Ammonium Hydroxide-based Aqueous Cleaning Compositions
App 20010039251 - SACHDEV, KRISHNA G. ; et al. | 2001-11-08 |
Aqueous cleaning of paste residue
Grant 6,277,799 - Sachdev , et al. August 21, 2 | 2001-08-21 |
Repair process for aluminum nitride substrates
Grant 6,262,390 - Goland , et al. July 17, 2 | 2001-07-17 |
Multi-thickness, multi-layer green sheet lamination and method thereof
Grant 6,245,171 - Natarajan , et al. June 12, 2 | 2001-06-12 |
Process for removing residue from screening masks with alkaline solution
Grant 5,888,308 - Sachdev , et al. March 30, 1 | 1999-03-30 |
Solvent-free epoxy based adhesives for semiconductor chip attachment and process
Grant 5,700,581 - Sachdev , et al. December 23, 1 | 1997-12-23 |
Polyester dispersants for high thermal conductivity paste
Grant 5,591,789 - Iruvanti , et al. January 7, 1 | 1997-01-07 |
Ceramic probe card and method for reducing leakage current
Grant 5,532,608 - Behfar-Rad , et al. July 2, 1 | 1996-07-02 |
Method of forming patterned polyimide films
Grant 5,470,693 - Sachdev , et al. November 28, 1 | 1995-11-28 |
Silicon-containing positive resist and use in multilayer metal structures
Grant 5,422,223 - Sachdev , et al. June 6, 1 | 1995-06-06 |
Method of forming patterned polyimide films
Grant 5,374,503 - Sachdev , et al. December 20, 1 | 1994-12-20 |
Process for thin film interconnect
Grant 5,231,751 - Sachdev , et al. August 3, 1 | 1993-08-03 |
Photosensitive polyimide compositions
Grant 5,114,826 - Kwong , et al. May 19, 1 | 1992-05-19 |
Electroerosion print media having protective coatings modified with organotitanium reagents
Grant 4,894,279 - Sachdev , et al. * January 16, 1 | 1990-01-16 |
Scratch resistant recording materials for electroerosion printing comprising cross-linked polymer base layer
Grant 4,830,909 - Cohen , et al. May 16, 1 | 1989-05-16 |
Method of selective reactive ion etching of substrates
Grant 4,826,564 - Desilets , et al. May 2, 1 | 1989-05-02 |
Method of bonding inorganic particulate material
Grant 4,772,346 - Anderson, Jr. , et al. September 20, 1 | 1988-09-20 |
Silicon-containing polyimides as oxygen etch stop and dual dielectric coatings
Grant 4,692,205 - Sachdev , et al. September 8, 1 | 1987-09-08 |
Hydrophilic protective coatings for electroerosion printing
Grant 4,617,579 - Sachdev , et al. October 14, 1 | 1986-10-14 |
Use of plasma polymerized organosilicon films in fabrication of lift-off masks
Grant 4,599,243 - Sachdev , et al. July 8, 1 | 1986-07-08 |
Electroerosion recording material with polyorganosiloxane overlayer
Grant 4,596,733 - Cohen , et al. June 24, 1 | 1986-06-24 |
Electroerosion recording medium of improved lubricity
Grant 4,567,490 - Afzali-Ardakani , et al. January 28, 1 | 1986-01-28 |
Scratch resistant recording materials for electroerosion printing not requiring a lubricant overcoat
Grant 4,554,562 - Afzali-Ardakani , et al. November 19, 1 | 1985-11-19 |
Electroerosion printing media using depolymerizable polymer coatings
Grant 4,550,061 - Sachdev , et al. October 29, 1 | 1985-10-29 |
Chemical heat amplification in thermal transfer printing
Grant 4,525,722 - Sachdev , et al. June 25, 1 | 1985-06-25 |
Use of depolymerizable polymers in the fabrication of lift-off structure for multilevel metal processes
Grant 4,519,872 - Anderson, Jr. , et al. May 28, 1 | 1985-05-28 |
Use of plasma polymerized organosilicon films in fabrication of lift-off masks
Grant 4,493,855 - Sachdev , et al. January 15, 1 | 1985-01-15 |
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