Patent | Date |
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Method for depositing nanolaminate thin films on sensitive surfaces Grant 7,749,871 - Elers , et al. July 6, 2 | 2010-07-06 |
Production of elemental films using a boron-containing reducing agent Grant 7,485,340 - Elers , et al. February 3, 2 | 2009-02-03 |
Method for depositing nanolaminate thin films on sensitive surfaces Grant 7,329,590 - Elers , et al. February 12, 2 | 2008-02-12 |
Production of elemental films using a boron-containing reducing agent App 20070190248 - Elers; Kai-Erik ;   et al. | 2007-08-16 |
Production of elemental films using a boron-containing reducing agent Grant 7,144,809 - Elers , et al. December 5, 2 | 2006-12-05 |
Method for depositing nanolaminate thin films on sensitive surfaces App 20060079090 - Elers; Kai-Erik ;   et al. | 2006-04-13 |
Method for depositing nanolaminate thin films on sensitive surfaces Grant 6,902,763 - Elers , et al. June 7, 2 | 2005-06-07 |
Method for depositing nanolaminate thin films on sensitive surfaces App 20050106877 - Elers, Kai-Erik ;   et al. | 2005-05-19 |
Production of elemental films using a boron-containing reducing agent App 20050064098 - Elers, Kai-Erik ;   et al. | 2005-03-24 |
Method of depositing transition metal nitride thin films Grant 6,863,727 - Elers , et al. March 8, 2 | 2005-03-08 |
Method for bottomless deposition of barrier layers in integrated circuit metallization schemes Grant 6,852,635 - Satta , et al. February 8, 2 | 2005-02-08 |
Production of elemental thin films using a boron-containing reducing agent Grant 6,821,889 - Elers , et al. November 23, 2 | 2004-11-23 |
Deposition of transition metal carbides Grant 6,800,552 - Elers , et al. October 5, 2 | 2004-10-05 |
Process for growing metal or metal carbide thin films utilizing boron-containing reducing agents Grant 6,794,287 - Saanila , et al. September 21, 2 | 2004-09-21 |
Method for bottomless deposition of barrier layers in integrated circuit metallization schemes App 20040121616 - Satta, Alessandra ;   et al. | 2004-06-24 |
Method for bottomless deposition of barrier layers in integrated circuit metallization schemes Grant 6,664,192 - Satta , et al. December 16, 2 | 2003-12-16 |
Process for growing metal or metal carbide thin films utilizing boron-containing reducing agents App 20030186495 - Saanila, Ville Antero ;   et al. | 2003-10-02 |
Process for growing metalloid thin films utilizing boron-containing reducing agents Grant 6,599,572 - Saanila , et al. July 29, 2 | 2003-07-29 |
Deposition of transition metal carbides App 20030031807 - Elers, Kai-Erik ;   et al. | 2003-02-13 |
Method of producing elemental thin films App 20020187256 - Elers, Kai-Erik ;   et al. | 2002-12-12 |
Deposition of transition metal carbides Grant 6,482,262 - Elers , et al. November 19, 2 | 2002-11-19 |
Production of elemental thin films using a boron-containing reducing agent Grant 6,475,276 - Elers , et al. November 5, 2 | 2002-11-05 |
Method for bottomless deposition of barrier layers in integrated circuit metallization schemes App 20020155722 - Satta, Alessandra ;   et al. | 2002-10-24 |
Method for bottomless deposition of barrier layers in integrated circuit metallization schemes Grant 6,391,785 - Satta , et al. May 21, 2 | 2002-05-21 |
Process for growing metalloid thin films App 20010009695 - Saanila, Ville Antero ;   et al. | 2001-07-26 |