RZEZNIK; Maria

Patent Applications and Registrations

Patent applications and USPTO patent grants for RZEZNIK; Maria.The latest application filed is for "copper electroplating baths containing reaction products of amines, polyacrylamides and and bisepoxoides".

Company Profile

2.8.15

RZEZNIK; Maria - Shrewsbury MA
Rzeznik; Maria - Marlborough MA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Copper Electroplating Baths Containing Reaction Products Of Amines, Polyacrylamides And And Bisepoxoides App 20210205052 - LU; Weijing ; et al.	2021-07-08
Copper electroplating baths containing compounds of reaction products of amines and polyacrylamides Grant 10,738,388 - Lu , et al. A	2020-08-11
Copper Electroplating Baths Containing Reaction Products Of Amines, Polyacrylamides And And Bisepoxoides App 20200179087 - LU; Weijing ; et al.	2020-06-11
Copper electroplating baths containing reaction products of aminex, polyacrylamides and bisepoxides Grant 10,662,541 - Lu , et al.	2020-05-26
Copper Electroplating Baths Containing Compounds Of Reaction Products Of Amines, Polyacrylamides And Sultones App 20200149176 - LU; Weijing ; et al.	2020-05-14
Copper electroplating baths containing compounds of reaction products of amines, polyacrylamides and sultones Grant 10,604,858 - Lu , et al.	2020-03-31
Copper electroplating baths containing compounds of reaction products of amines and quinones Grant 10,590,556 - Lu , et al.	2020-03-17
Polymers containing benzimidazole moieties as levelers Grant 10,201,097 - Duan , et al. Fe	2019-02-05
Nitrogen containing polymers as levelers Grant 10,196,751 - Duan , et al. Fe	2019-02-05
Copper Electroplating Baths Containing Reaction Products Of Aminex, Polyacrylamides And Bisepoxides App 20180245228 - LU; Weijing ; et al.	2018-08-30
Copper Electroplating Baths Containing Compounds Of Reaction Products Of Amines And Polyacrylamides App 20180237929 - LU; Weijing ; et al.	2018-08-23
Copper Electroplating Baths Containing Compounds Of Reaction Products Of Amines And Quinones App 20180237930 - LU; Weijing ; et al.	2018-08-23
Copper Electroplating Baths Containing Compounds Of Reaction Products Of Amines, Polyacrylamides And Sultones App 20180237931 - LU; Weijing ; et al.	2018-08-23
Electroless metallization of dielectrics with alkaline stable pyrazine derivative containing catalysts Grant 9,918,389 - Liu , et al. March 13, 2	2018-03-13
Horizontal Method Of Electroless Metal Plating Of Substrates With Ionic Catalysts App 20170251557 - Liu; Feng ; et al.	2017-08-31
Electroless Metallization Of Dielectrics With Alkaline Stable Pyrimidine Derivative Containing Catalysts App 20170175272 - Milum; Kristen ; et al.	2017-06-22
Electroless Metallization Of Dielectrics With Alkaline Stable Pyrazine Derivative Containing Catalysts App 20170156216 - Liu; Feng ; et al.	2017-06-01
Stable catalysts for electroless metallization Grant 9,611,549 - Liu , et al. April 4, 2	2017-04-04
Electroless Metallization Of Dielectrics With Alkaline Stable Pyrimidine Derivative Containing Catalysts App 20170044671 - Milum; Kristen ; et al.	2017-02-16
Electroless Metallization Of Dielectrics With Alkaline Stable Pyrazine Derivative Containing Catalysts App 20170042039 - Liu; Feng ; et al.	2017-02-09
Polymers Containing Benzimidazole Moieties As Levelers App 20160255729 - Duan; Lingli ; et al.	2016-09-01
Nitrogen Containing Polymers As Levelers App 20160237579 - Duan; Lingli ; et al.	2016-08-18
Stable Catalysts For Electroless Metallization App 20150284856 - Liu; Feng ; et al.	2015-10-08

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