Ryu; Jung-su

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ryu; Jung-su.The latest application filed is for "interposer pattern with pad chain".

Company Profile

0.3.8

Ryu; Jung-su - Seongnam-si KR
Ryu; Jung-Su - Seongnam-shi KR
Ryu, Jung-su - Gyeonggi-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Multi-chip packaged integrated circuit device for transmitting signals from one chip to another chip Grant 7,429,794 - Ryu , et al. September 30, 2	2008-09-30
Interposer pattern with pad chain App 20070152316 - Ryu; Jung-su ; et al.	2007-07-05
Semiconductor device having test element groups Grant 7,224,176 - Ryu , et al. May 29, 2	2007-05-29
Integrated circuit pad with separate probing and bonding areas App 20070018340 - Kim; Young-Dae ; et al.	2007-01-25
Apparatus and method for testing a multi-stack integrated circuit package App 20070018300 - Ryu; Jung-su ; et al.	2007-01-25
Multi-chip packaged integrated circuit device for transmitting signals from one chip to another chip App 20050280165 - Ryu, Jung-su ; et al.	2005-12-22
Bonding pad arrangement method for semiconductor devices Grant 6,949,837 - Lee , et al. September 27, 2	2005-09-27
Bonding pad arrangement method for semiconductor devices App 20050194664 - Lee, Ho-Cheol ; et al.	2005-09-08
ESD protecting circuit embedded in an SIP chip using a plurality of power sources App 20050052799 - Kim, Byeong-yun ; et al.	2005-03-10
Semiconductor device having test element groups App 20040017217 - Ryu, Jung-Su ; et al.	2004-01-29
Pad arrangement method for reducing bonding failures and signal skew App 20040000726 - Lee, Ho-Cheol ; et al.	2004-01-01

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