Ryu; Joung Gul
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ryu; Joung Gul.The latest application filed is for "coil component".
Company Profile
25.30.53
- Ryu; Joung Gul - Suwon-si KR
- Ryu; Joung Gul - Yongin KR
- RYU; Joung Gul - Yongin-si KR
- Ryu; Joung-Gul - Seoul N/A KR
- Ryu; Joung-Gul - Suwon KR
Patent Activity
| Patent | Date |
|---|---|
| Coil component Grant 11,398,343 - Yang , et al. July 26, 2 | 2022-07-26 |
| Coil component Grant 11,380,475 - Kim , et al. July 5, 2 | 2022-07-05 |
| Coil Component App 20210375530 - KANG; Byung Soo ; et al. | 2021-12-02 |
| Coil Component App 20210350971 - Ryu; Joung Gul ; et al. | 2021-11-11 |
| Coil Component App 20210335532 - Yang; Ju Hwan ; et al. | 2021-10-28 |
| Coil component Grant 11,158,453 - Kang , et al. October 26, 2 | 2021-10-26 |
| Inductor and method for manufacturing the same Grant 11,145,452 - Kim , et al. October 12, 2 | 2021-10-12 |
| Inductor Grant 11,127,523 - Kim , et al. September 21, 2 | 2021-09-21 |
| Coil component Grant 11,107,622 - Kang , et al. August 31, 2 | 2021-08-31 |
| Coil component and method for manufacturing the same Grant 11,094,458 - Bong , et al. August 17, 2 | 2021-08-17 |
| Coil component Grant 11,037,718 - Ryu June 15, 2 | 2021-06-15 |
| Coil Component App 20210175004 - KIM; Jae Hun ; et al. | 2021-06-10 |
| Coil component Grant 10,998,125 - Ryu , et al. May 4, 2 | 2021-05-04 |
| Coil component Grant 10,984,942 - Kim , et al. April 20, 2 | 2021-04-20 |
| Coil Component App 20210090784 - Kim; Jae Hun ; et al. | 2021-03-25 |
| Coil Component App 20210057146 - YANG; Ju Hwan ; et al. | 2021-02-25 |
| Coil Component App 20210050140 - RYU; Joung Gul ; et al. | 2021-02-18 |
| Coil component Grant 10,923,266 - Ryu February 16, 2 | 2021-02-16 |
| Coil Component App 20210027931 - YANG; Ju Hwan ; et al. | 2021-01-28 |
| Coil Component App 20210005365 - Jung; Ji Hyung ; et al. | 2021-01-07 |
| Coil Component App 20200335256 - JUNG; Ji Hyung ; et al. | 2020-10-22 |
| Coil component Grant 10,796,840 - Ryu , et al. October 6, 2 | 2020-10-06 |
| Thin film type inductor Grant 10,741,321 - Kim , et al. A | 2020-08-11 |
| Thin film-type inductor Grant 10,707,009 - Ryu , et al. | 2020-07-07 |
| Coil Component App 20200118730 - Ryu; Joung Gul ; et al. | 2020-04-16 |
| Coil Component App 20200082974 - Kim; Mi Geum ; et al. | 2020-03-12 |
| Thin film inductor and method of manufacturing the same Grant 10,553,346 - Ryu Fe | 2020-02-04 |
| Chip Inductor And Method Of Manufacturing The Same App 20200027644 - Ryu; Joung Gul ; et al. | 2020-01-23 |
| Coil Component App 20200027650 - Ryu; Joung Gul ; et al. | 2020-01-23 |
| Inductor App 20190371513 - KIM; Mi Geum ; et al. | 2019-12-05 |
| Coil Component App 20190362883 - KANG; Byung Soo ; et al. | 2019-11-28 |
| Coil Component App 20190333687 - YANG; Ju Hwan ; et al. | 2019-10-31 |
| Coil Component App 20190304672 - KANG; Byung Soo ; et al. | 2019-10-03 |
| Coil Component App 20190287711 - KIM; Jae Hun ; et al. | 2019-09-19 |
| Coil Component App 20190279807 - RYU; Joung Gul | 2019-09-12 |
| Coil Component App 20190180914 - RYU; Joung Gul | 2019-06-13 |
| Coil Component App 20190180905 - RYU; Joung Gul ; et al. | 2019-06-13 |
| Thin Film Type Inductor App 20190013143 - KIM; Boum Seock ; et al. | 2019-01-10 |
| Coil Component And Method For Manufacturing The Same App 20190006100 - BONG; Kang Wook ; et al. | 2019-01-03 |
| Thin Film-type Inductor App 20180374627 - RYU; Joung Gul ; et al. | 2018-12-27 |
| Coil Component And Method Of Manufacturing The Same App 20180350505 - RYU; Joung Gul ; et al. | 2018-12-06 |
| Inductor And Method For Manufacturing The Same App 20180197672 - KIM; Boum Seock ; et al. | 2018-07-12 |
| Thin Film Inductor And Method Of Manufacturing The Same App 20180122554 - RYU; Joung Gul | 2018-05-03 |
| Printed circuit board with warpage prevention layer Grant 9,456,492 - Ryu , et al. September 27, 2 | 2016-09-27 |
| Printed Circuit Board And Method Of Manufacturing The Same App 20150245484 - Ryu; Joung Gul ; et al. | 2015-08-27 |
| Printed Circuit Board App 20150136446 - RYU; Joung Gul ; et al. | 2015-05-21 |
| Method of manufacturing and insulating sheet Grant 8,997,340 - Sohn , et al. April 7, 2 | 2015-04-07 |
| Laminate For Printed Circuit Board, Printed Circuit Board Using The Same, And Method Of Manufacturing The Same App 20150041206 - Ryu; Joung Gul ; et al. | 2015-02-12 |
| Heat dissipating substrate and method of manufacturing the same Grant 8,926,714 - Lee , et al. January 6, 2 | 2015-01-06 |
| Heat Dissipating Substrate And Method Of Manufacturing The Same App 20140165346 - LEE; Sang Youp ; et al. | 2014-06-19 |
| Filter App 20140124434 - Lee; Jae-Joon ; et al. | 2014-05-08 |
| Heat dissipating substrate and method of manufacturing the same Grant 8,704,100 - Lee , et al. April 22, 2 | 2014-04-22 |
| Core Substrate And Printed Circuit Board Using The Same App 20140041907 - Kim; Young Ji ; et al. | 2014-02-13 |
| Method of fabricating semiconductor plastic package including a core board, build-up insulation layer, printed circuit, and semiconductor chip Grant 8,647,926 - Shin , et al. February 11, 2 | 2014-02-11 |
| Method of manufacturing a printed circuit board Grant 8,499,441 - Park , et al. August 6, 2 | 2013-08-06 |
| Printed circuit board with reinforced thermoplastic resin layer Grant 8,450,618 - Sohn , et al. May 28, 2 | 2013-05-28 |
| Manufacturing an insulating sheet, a copper clad laminate, and a printed circuit board Grant 8,397,378 - Sohn , et al. March 19, 2 | 2013-03-19 |
| Printed circuit board and method of manufacturing the same App 20120043128 - Yoon; Kyoung Ro ; et al. | 2012-02-23 |
| Method of manufacturing printed circuit board App 20120030938 - Park; Ho-Sik ; et al. | 2012-02-09 |
| Printed circuit board App 20120018195 - Park; Ho-Sik ; et al. | 2012-01-26 |
| Method of manufacturing insulating sheet and printed circuit board having the same App 20120012247 - Sohn; Keungjin ; et al. | 2012-01-19 |
| Printed circuit board App 20120012379 - Park; Ho-Sik ; et al. | 2012-01-19 |
| Printed circuit board with reinforced thermoplastic resin layer App 20110315437 - Sohn; Keung-Jin ; et al. | 2011-12-29 |
| Printed circuit board and manufacturing method of the same App 20110139499 - Park; Jung-Hwan ; et al. | 2011-06-16 |
| Printed Circuit Board And Manufacturing Method Thereof App 20110127073 - Ryu; Joung-Gul ; et al. | 2011-06-02 |
| Metallic Laminate And Manufacturing Method Of Core Substrate Using The Same App 20110126970 - LEE; Sang-Youp ; et al. | 2011-06-02 |
| Core Substrate And Method Of Manufacturing Core Substrate App 20110123772 - Lee; Sang-Youp ; et al. | 2011-05-26 |
| Heat Dissipating Substrate And Method Of Manufacturing The Same App 20110114369 - LEE; Sang Youp ; et al. | 2011-05-19 |
| Semiconductor plastic package and fabricating method thereof Grant 7,893,527 - Shin , et al. February 22, 2 | 2011-02-22 |
| Method of fabricating semiconductor plastic package App 20100330747 - Shin; Joon-Sik ; et al. | 2010-12-30 |
| Metal core package substrate and method for manufacturing the same App 20090288293 - Lee; Sang Youp ; et al. | 2009-11-26 |
| Manufacturing an insulating sheet, a copper clad laminate, and a printed circuit board App 20090255714 - Sohn; Keung-Jin ; et al. | 2009-10-15 |
| Printed circuit board and manufacturing method thereof App 20090250253 - Park; Ho-Sik ; et al. | 2009-10-08 |
| Insulating sheet and printed circuit board having the same App 20090242248 - Sohn; Keungjin ; et al. | 2009-10-01 |
| Method for manufacturing insulating sheet and method for manufacturing metal clad laminate and printed circuit board using the same App 20090236038 - Ikeguchi; Nobuyuki ; et al. | 2009-09-24 |
| Printed circuit board and manufacturing method of the same App 20090084595 - Park; Jung-Hwan ; et al. | 2009-04-02 |
| Semiconductor plastic package and fabricating method thereof App 20090026604 - Shin; Joon-Sik ; et al. | 2009-01-29 |
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