Ryu; Ji Man

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ryu; Ji Man.The latest application filed is for "coil component".

Company Profile

3.7.13

Ryu; Ji Man - Suwon-si KR
Ryu; Ji Man - Seongnam-si KR
Ryu; Ji Man - Suwon KR
Ryu; Ji Man - Gyunggi-do N/A KR
Ryu; Ji-Man - Jeonllabukdo KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Coil Component App 20210335532 - Yang; Ju Hwan ; et al.	2021-10-28
Coil component Grant 10,984,942 - Kim , et al. April 20, 2	2021-04-20
Coil Component App 20200118730 - Ryu; Joung Gul ; et al.	2020-04-16
Coil Component App 20190287711 - KIM; Jae Hun ; et al.	2019-09-19
Inductor Grant 10,147,533 - Lyoo , et al. De	2018-12-04
Magnetic sheet, wireless charging sheet and method for manufacturing magnetic sheet Grant 9,793,741 - Yeo , et al. October 17, 2	2017-10-17
Inductor App 20160351321 - LYOO; Soo Hyun ; et al.	2016-12-01
Multilayer ferrite sheet, antenna device using the same, and manufacturing method thereof Grant 9,391,363 - Choi , et al. July 12, 2	2016-07-12
Magnetic composite sheet and electromagnetic induction module Grant 9,088,068 - Choi , et al. July 21, 2	2015-07-21
Magnetic Sheet, Wireless Charging Sheet And Method For Manufacturing Magnetic Sheet App 20150102892 - YEO; Jeong Gu ; et al.	2015-04-16
Semiconductor package and method for manufacturing the same and semiconductor package module having the same Grant 8,786,064 - Kim , et al. July 22, 2	2014-07-22
Multilayer Ferrite Sheet, Antenna Device Using The Same, And Manufacturing Method Thereof App 20140176380 - Choi; Dong Hyeok ; et al.	2014-06-26
Magnetic Composite Sheet And Electromagnetic Induction Module App 20140176381 - CHOI; Dong Hyeok ; et al.	2014-06-26
Contactless Power Transmission Device And Method Of Fabricating The Same App 20140145512 - CHOI; Kang Ryong ; et al.	2014-05-29
Magnetic Sheet Of Contactless Power Transmission Device App 20140145807 - CHOI; Kang Ryong ; et al.	2014-05-29
Semiconductor Package And Method For Manufacturing The Same And Semiconductor Package Module Having The Same App 20130105955 - Kim; Jin Su ; et al.	2013-05-02
Soldering Connecting Pin, Semiconductor Package Substrate And Method Of Mounting Semiconductor Chip Using The Same App 20120127681 - RYU; Ji Man ; et al.	2012-05-24
Flaky Powder for an Electromagnetic Wave Absorber, and Method for Producing Same App 20110056593 - Lee; Jai-Sung ; et al.	2011-03-10

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