Ryu; Hee Jeong
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ryu; Hee Jeong.The latest application filed is for "leveling agent and copper plating composition comprising the same".
- Ryu; Hee Jeong - Daegu KR
- Ryu; Hee Jeong - Seongnam-si KR
- RYU; Hee Jeong - Suwon-si KR
| Patent | Date |
|---|---|
| Methods for treating inflammatory diseases Grant 11,129,861 - Ku , et al. September 28, 2 | 2021-09-28 |
| Electroplating composition and electroplating method Grant 11,035,050 - Yun , et al. June 15, 2 | 2021-06-15 |
| Leveling Agent And Copper Plating Composition Comprising The Same App 20210062353 - YUN; Jong Cheol ; et al. | 2021-03-04 |
| Leveling agent and electroplating composition comprising the same Grant 10,760,174 - Jang , et al. Sep | 2020-09-01 |
| Electroplating Composition And Electroplating Method App 20200123671 - YUN; Jong Cheol ; et al. | 2020-04-23 |
| Composition For Cobalt Plating And Method For Forming Metal Wiring Using The Same App 20190186032 - RYU; Hee Jeong ; et al. | 2019-06-20 |
| Leveling Agent And Electroplating Composition Comprising The Same App 20190161878 - JANG; Min Jung ; et al. | 2019-05-30 |
| Leveling Agent And Copper Plating Composition Comprising The Same App 20190161877 - YUN; Jong Cheol ; et al. | 2019-05-30 |
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