Ryu; Chang Myung

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ryu; Chang Myung.The latest application filed is for "depth sensing with a ranging sensor and an image sensor".

Company Profile

2.13.14

Ryu; Chang Myung - San Jose CA
Ryu; Chang Myung - Cupertino CA
Ryu; Chang Myung - Gyeonggi-do KR
Ryu; Chang Myung - Kyunggi-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Depth sensing with a ranging sensor and an image sensor Grant 11,373,322 - Yang , et al. June 28, 2	2022-06-28
Depth Sensing With A Ranging Sensor And An Image Sensor App 20210201517 - YANG; Xiaoyong ; et al.	2021-07-01
Three-dimensional time-of-flight sensors for a transportation system Grant 10,705,191 - Ryu , et al.	2020-07-07
Three-dimensional Time-of-flight Sensors For A Transportation System App 20190033433 - RYU; Chang Myung ; et al.	2019-01-31
Microelectronic interconnect element with decreased conductor spacing Grant 9,856,135 - Ryu , et al. January 2, 2	2018-01-02
Microelectronic Interconnect Element With Decreased Conductor Spacing App 20170096329 - Ryu; Chang Myung ; et al.	2017-04-06
Microelectronic interconnect element with decreased conductor spacing Grant 9,524,947 - Ryu , et al. December 20, 2	2016-12-20
Microelectronic Interconnect Element With Decreased Conductor Spacing App 20150087146 - Ryu; Chang Myung ; et al.	2015-03-26
Method of making a microelectronic interconnect element with decreased conductor spacing Grant 8,900,464 - Ryu , et al. December 2, 2	2014-12-02
Method of Making a Microelectronic Interconnect Element With Decreased Conductor Spacing App 20130341299 - RYU; Chang Myung ; et al.	2013-12-26
Microelectronic Substrate Or Element Having Conductive Pads And Metal Posts Joined Thereto Using Bond Layer App 20130186944 - Haba; Belgacem ; et al.	2013-07-25
Microelectronic interconnect element with decreased conductor spacing Grant 8,461,460 - Ryu , et al. June 11, 2	2013-06-11
Printed circuit board including embedded capacitor and method of fabricating same Grant 7,888,599 - Kim , et al. February 15, 2	2011-02-15
Microelectronic substrate or element having conductive pads and metal posts joined thereto using bond layer App 20100044860 - Haba; Belgacem ; et al.	2010-02-25
Microelectronic interconnect element with decreased conductor spacing App 20100009554 - Ryu; Chang Myung ; et al.	2010-01-14
High frequency signal transmission line having ground line blocks to reduce noise Grant 7,543,264 - Kim , et al. June 2, 2	2009-06-02
Printed Circuit Board Including Embedded Capacitor And Method Of Fabricating Same App 20080314863 - Kim; Young Woo ; et al.	2008-12-25
Printed circuit board including embedded capacitor and method of fabricating same Grant 7,435,911 - Kim , et al. October 14, 2	2008-10-14
Printed circuit board having axially parallel via holes Grant 7,408,120 - Kim , et al. August 5, 2	2008-08-05
Capacitor-embedded PCB having blind via hole and method of manufacturing the same Grant 7,282,648 - Kim , et al. October 16, 2	2007-10-16
Printed circuit board having three-dimensional spiral inductor and method of fabricating same Grant 7,170,384 - Kim , et al. January 30, 2	2007-01-30
Capacitor-embedded PCB having blind via hole and method of manufacturing the same App 20060207791 - Kim; Han ; et al.	2006-09-21
Printed circuit board including embedded capacitor and method of fabricating same App 20060144617 - Kim; Young Woo ; et al.	2006-07-06
Printed circuit board having three-dimensional spiral inductor and method of fabricating same App 20060145805 - Kim; Han ; et al.	2006-07-06
High frequency signal transmission line having reduced noise App 20060146484 - Kim; Young Woo ; et al.	2006-07-06
Printed circuit board having axially parallel via holes App 20050178585 - Kim, Young Woo ; et al.	2005-08-18

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