Russell; Ernest J.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Russell; Ernest J..The latest application filed is for "microelectronic device assemblies having a shielded input and methods for manufacturing and operating such microelectronic device assemblies".

Company Profile

0.15.2

Russell; Ernest J. - McKinney TX
Russell, Ernest J. - Richmond TX
Russell; Ernest J. - Greensboro NC

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Microelectronic device assemblies having a shielded input and methods for manufacturing and operating such microelectronic device assemblies Grant 6,784,367 - Russell , et al. August 31, 2	2004-08-31
Microelectronic device assemblies having a shielded input and methods for manufacturing and operating such microelectronic device assemblies App 20030127241 - Russell, Ernest J. ; et al.	2003-07-10
Microelectronic device assemblies having a shielded input and methods for manufacturing and operating such microelectronic device assemblies Grant 6,548,757 - Russell , et al. April 15, 2	2003-04-15
Method and apparatus for delivering electrical power to a semiconductor die App 20010005039 - Russell, Ernest J.	2001-06-28
Vertical passive components for surface mount assembly Grant 6,040,983 - Baudouin , et al. March 21, 2	2000-03-21
High density semiconductor package Grant 5,637,828 - Russell , et al. June 10, 1	1997-06-10
Semiconductor package having interdigitated leads Grant 5,600,178 - Russell February 4, 1	1997-02-04
Method for a hybrid leadframe-over-chip semiconductor package Grant 5,589,420 - Russell December 31, 1	1996-12-31
Leadframe-over-chip having off-chip conducting leads for increased bond pad connectivity Grant 5,545,920 - Russell August 13, 1	1996-08-13
Reduced capacitance lead frame for lead on chip package Grant 5,521,426 - Russell May 28, 1	1996-05-28
High density semiconductor package Grant 5,483,024 - Russell , et al. January 9, 1	1996-01-09
Method for packaging an integrated circuit Grant 5,396,701 - Russell March 14, 1	1995-03-14
Method of making a relatively flat semiconductor package having a semiconductor chip encapsulated in molded material Grant 5,275,975 - Baudouin , et al. January 4, 1	1994-01-04
Edge-mounted, surface-mount package for semiconductor integrated circuit devices Grant 4,975,763 - Baudouin , et al. December 4, 1	1990-12-04
Continuous aqueous dyeing process for high-tenacity industrial nylon fabrics Grant 4,812,140 - Russell , et al. March 14, 1	1989-03-14
Process for simultaneously dyeing and improving the flame-resistant properties of aramid fibers Grant 4,759,770 - Cates , et al. July 26, 1	1988-07-26
Process for improving the flame-resistant properties of aramid fibers Grant 4,749,378 - Cates , et al. June 7, 1	1988-06-07

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