loadpatents
name:-0.0095329284667969
name:-0.021934032440186
name:-0.0012040138244629
Russell; David John Patent Filings

Russell; David John

Patent Applications and Registrations

Patent applications and USPTO patent grants for Russell; David John.The latest application filed is for "copper feature design for warpage control of substrates".

Company Profile
0.22.9
  • Russell; David John - Oswego NY
  • Russell; David John - Owego NY US
  • Russell; David John - Apalachin NY
  • Russell; David John - Heidelberg AU
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Copper feature design for warpage control of substrates
Grant 9,659,131 - Blackshear , et al. May 23, 2
2017-05-23
Copper Feature Design for Warpage Control of Substrates
App 20150317423 - Blackshear; Edmund ;   et al.
2015-11-05
Copper feature design for warpage control of substrates
Grant 9,105,535 - Blackshear , et al. August 11, 2
2015-08-11
Method for forming coreless flip chip ball grid array (FCBGA) substrates and such substrates formed by the method
Grant 8,841,209 - Allard , et al. September 23, 2
2014-09-23
Copper Feature Design for Warpage Control of Substrates
App 20130334711 - Blackshear; Edmund ;   et al.
2013-12-19
Electrical contact alignment posts
Grant 8,530,345 - West , et al. September 10, 2
2013-09-10
Electrical Contact Alignment Posts
App 20130157455 - West; David Justin ;   et al.
2013-06-20
Electrical contact alignment posts
Grant 8,415,792 - West , et al. April 9, 2
2013-04-09
Method For Forming Coreless Flip Chip Ball Grid Array (fcbga) Substrates And Such Substrates Formed By The Method
App 20130043060 - Allard; Sylvie ;   et al.
2013-02-21
Photoimaged dielectric polymer and film, and circuit package containing the same
Grant 7,118,837 - Jakubek , et al. October 10, 2
2006-10-10
Photoimaged dielectric polymer and film, and circuit package containing the same
App 20050106504 - Jakubek, Vladimir ;   et al.
2005-05-19
Photoimaged dielectric, its manufacture and use in electronics
Grant 6,806,033 - Jakubek , et al. October 19, 2
2004-10-19
Circuitized structures produced by the methods of electroless plating
Grant 6,680,440 - Russell , et al. January 20, 2
2004-01-20
Photoimagable dielectric, its manufacture and use in electronics
App 20030165771 - Jakubek, Vladimir ;   et al.
2003-09-04
Composition for photoimaging
App 20020177072 - Day, Richard Allen ;   et al.
2002-11-28
Composition for photoimaging
Grant 6,210,862 - Day , et al. April 3, 2
2001-04-03
Information handling system with circuit assembly having holes filled with filler material
Grant 6,178,093 - Bhatt , et al. January 23, 2
2001-01-23
Process for high resolution photoimageable dielectric
Grant 6,022,670 - Russell , et al. February 8, 2
2000-02-08
Process for manufacturing a circuit with filled holes
Grant 6,000,129 - Bhatt , et al. December 14, 1
1999-12-14
Process for high resolution photoimageable dielectric
Grant 5,993,945 - Russell , et al. November 30, 1
1999-11-30
Method for manufacturing a high density electronic circuit assembly
Grant 5,985,760 - Lauffer , et al. November 16, 1
1999-11-16
Apparatus and process for improved die adhesion to organic chip carriers
Grant 5,955,782 - Kosteva , et al. September 21, 1
1999-09-21
Modular circuit package having vertically aligned power and signal cores
Grant 5,876,842 - Duffy , et al. March 2, 1
1999-03-02
Electric circuit card having a donut shaped land
Grant 5,670,750 - Lauffer , et al. September 23, 1
1997-09-23
Method for manufacturing a high density electronic circuit assembly
Grant 5,665,650 - Lauffer , et al. September 9, 1
1997-09-09
Arrangement for preventing interruptions in a time division multiplex transmission link for transfer of data
Grant 3,940,566 - Jeppsson , et al. February 24, 1
1976-02-24

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