loadpatents
Patent applications and USPTO patent grants for Rumsey; Robert.The latest application filed is for "chip-scale package conversion technique for dies".
Patent | Date |
---|---|
Chip-scale package conversion technique for dies Grant 7,979,813 - Rumsey , et al. July 12, 2 | 2011-07-12 |
Chip-Scale Package Conversion Technique for Dies App 20100180249 - Rumsey; Robert ;   et al. | 2010-07-15 |
Integrating chip scale packaging metallization into integrated circuit die structures Grant 7,211,893 - Alter , et al. May 1, 2 | 2007-05-01 |
Integrating chip scale packaging metallization into integrated circuit die structures Grant 6,900,538 - Alter , et al. May 31, 2 | 2005-05-31 |
Integrating chip scale packaging metallization into integrated circuit die structures App 20050062156 - Alter, Martin ;   et al. | 2005-03-24 |
Integrating chip scale packaging metallization into integrated circuit die structures App 20040245633 - Alter, Martin ;   et al. | 2004-12-09 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.