Rumer; Christopher L.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Rumer; Christopher L..The latest application filed is for "package on package thermal transfer systems and methods".

Company Profile

3.28.31

Rumer; Christopher L. - Chandler AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Thermally coupled package-on-package semiconductor packages Grant 11,222,877 - Karhade , et al. January 11, 2	2022-01-11
Package on package thermal transfer systems and methods Grant 11,056,466 - Karhade , et al. July 6, 2	2021-07-06
Package On Package Thermal Transfer Systems And Methods App 20190385983 - KARHADE; OMKAR ; et al.	2019-12-19
Package on package thermal transfer systems and methods Grant 10,438,930 - Karhade , et al. O	2019-10-08
Thermally Coupled Package-on-package Semiconductor App 20190103385 - KARHADE; OMKAR ; et al.	2019-04-04
Package On Package Thermal Transfer Systems And Methods App 20190006319 - KARHADE; OMKAR ; et al.	2019-01-03
Adaptive Tcb By Data Feed Forward App 20170154828 - GOSSELIN; Timothy A. ; et al.	2017-06-01
Semiconductor wafer coat layers and methods therefor Grant 8,193,072 - Li , et al. June 5, 2	2012-06-05
Heat dissipating device with preselected designed interface for thermal interface materials Grant 7,996,989 - Dani , et al. August 16, 2	2011-08-16
Semiconductor Wafer Coat Layers And Methods Therefor App 20110059596 - Li; Eric J. ; et al.	2011-03-10
Semiconductor wafer coat layers and methods therefor Grant 7,897,486 - Li , et al. March 1, 2	2011-03-01
Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly Grant 7,846,778 - Rumer , et al. December 7, 2	2010-12-07
No-flow underfill composition and method Grant 7,619,318 - Rumer , et al. November 17, 2	2009-11-17
Dual pulsed beam laser micromachining method Grant 7,611,966 - Li , et al. November 3, 2	2009-11-03
Heat dissipating device with preselected designed interface for thermal interface materials Grant 7,527,090 - Dani , et al. May 5, 2	2009-05-05
Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly Grant 7,473,995 - Rumer , et al. January 6, 2	2009-01-06
Heat Dissipating Device With Preselected Designed Interface For Thermal Interface Materials App 20080185713 - Dani; Ashay A. ; et al.	2008-08-07
Apparatus to compensate for stress between heat spreader and thermal interface material Grant 7,358,606 - Rumer , et al. April 15, 2	2008-04-15
Thermal interface material and electronic assembly having such a thermal interface material Grant 7,311,967 - Dani , et al. December 25, 2	2007-12-25
Package and method for attaching an integrated heat spreader Grant 7,304,381 - Rumer , et al. December 4, 2	2007-12-04
Laser micromachining method Grant 7,303,977 - Voronov , et al. December 4, 2	2007-12-04
Semiconductor wafer coat layers and methods therefor Grant 7,279,362 - Li , et al. October 9, 2	2007-10-09
Semiconductor wafer coat layers and methods therefor App 20070218652 - Li; Eric J. ; et al.	2007-09-20
Method and apparatus for a dual substrate package Grant 7,247,517 - Rumer , et al. July 24, 2	2007-07-24
Laser micromachining method Grant 7,169,687 - Li , et al. January 30, 2	2007-01-30
Package And Method For Attaching An Integrated Heat Spreader App 20060267182 - Rumer; Christopher L. ; et al.	2006-11-30
Dual pulsed beam laser micromachining method App 20060249816 - Li; Eric J. ; et al.	2006-11-09
Semiconductor wafer coat layers and methods therefor App 20060223284 - Li; Eric J. ; et al.	2006-10-05
Method for handling integrated circuit die Grant 7,059,045 - Lu , et al. June 13, 2	2006-06-13
Laser micromachining method App 20060099810 - Voronov; Sergei L. ; et al.	2006-05-11
Laser micromachining method App 20060091125 - Li; Eric J. ; et al.	2006-05-04
Laser ablation method App 20060088984 - Li; Eric J. ; et al.	2006-04-27
No-flow underfill composition and method App 20060025500 - Rumer; Christopher L. ; et al.	2006-02-02
Metal ball attachment of heat dissipation devices Grant 6,992,891 - Mallik , et al. January 31, 2	2006-01-31
No-flow underfill composition and method Grant 6,982,492 - Rumer , et al. January 3, 2	2006-01-03
Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials Grant 6,974,723 - Matayabas, Jr. , et al. December 13, 2	2005-12-13
Microelectronic packaging and methods for thermally protecting package interconnects and components App 20050214977 - Rumer, Christopher L. ; et al.	2005-09-29
Through silicon via, folded flex microelectronic package Grant 6,924,551 - Rumer , et al. August 2, 2	2005-08-02
Microelectronic packaging and methods for thermally protecting package interconnects and components Grant 6,911,726 - Rumer , et al. June 28, 2	2005-06-28
Method and device for handling integrated circuit die App 20050120551 - Lu, Daoqiang ; et al.	2005-06-09
Method and apparatus for bonding a wire to a bond pad on a device Grant 6,892,927 - Rumer , et al. May 17, 2	2005-05-17
No-flow underfill composition and method App 20050087891 - Rumer, Christopher L. ; et al.	2005-04-28
Method and apparatus for a dual substrate package App 20050067714 - Rumer, Christopher L. ; et al.	2005-03-31
Integrated circuit packaging design and method Grant 6,867,124 - Clemons , et al. March 15, 2	2005-03-15
Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials App 20050040507 - Matayabas, James C. JR. ; et al.	2005-02-24
Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials Grant 6,841,867 - Matayabas, Jr. , et al. January 11, 2	2005-01-11
Heat dissipating device with preselected designed interface for thermal interface materials App 20040261980 - Dani, Ashay A. ; et al.	2004-12-30
Through silicon via, folded flex microelectronic package App 20040238936 - Rumer, Christopher L. ; et al.	2004-12-02
Package and method for attaching an integrated heat spreader App 20040238947 - Rumer, Christopher L. ; et al.	2004-12-02
Apparatus to compensate for stress between heat spreader and thermal interface material App 20040217467 - Rumer, Christopher L. ; et al.	2004-11-04
Method and apparatus for bonding a wire to a bond pad on a device App 20040211761 - Rumer, Christopher L. ; et al.	2004-10-28
Metal ball attachment of heat dissipation devices App 20040196634 - Mallik, Debendra ; et al.	2004-10-07
Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials App 20040124526 - Matayabas, James C. JR. ; et al.	2004-07-01
Method to compensate for stress between heat spreader and thermal interface material Grant 6,748,350 - Rumer , et al. June 8, 2	2004-06-08
Microelectronic packaging and methods for thermally protecting package interconnects and components App 20030227066 - Rumer, Christopher L. ; et al.	2003-12-11
Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly App 20030178720 - Rumer, Christopher L. ; et al.	2003-09-25
Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly App 20030178730 - Rumer, Christopher L. ; et al.	2003-09-25
Thermal interface material and electronic assembly having such a thermal interface material App 20030077478 - Dani, Ashay A. ; et al.	2003-04-24
Method to compensate for stress between heat spreader and thermal interface material App 20030058620 - Rumer, Christopher L. ; et al.	2003-03-27

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