Rudzki; Jacek

Patent Applications and Registrations

Patent applications and USPTO patent grants for Rudzki; Jacek.The latest application filed is for "semiconductor module with a first substrate, a second substrate and a spacer separating the substrates from each other".

Company Profile

7.14.15

Rudzki; Jacek - Flensburg DE
Rudzki; Jacek - Kiel DE
Rudzki; Jacek - Nordborg DK

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Module Comprising A Semiconductor And Comprising A Shaped Metal Body That Is Electrically Contacted By The Semiconductor App 20220302072 - Bastos Abibe; Andre ; et al.	2022-09-22
Semiconductor Module With A First Substrate, A Second Substrate And A Spacer Separating The Substrates From Each Other App 20220302073 - Becker; Martin ; et al.	2022-09-22
Sintering tool and method for sintering an electronic subassembly Grant 11,400,514 - Osterwald , et al. August 2, 2	2022-08-02
Sintering Tool And Method For Sintering An Electronic Subassembly App 20210016353 - Osterwald; Frank ; et al.	2021-01-21
Sintering tool and method for sintering an electronic subassembly Grant 10,814,396 - Osterwald , et al. October 27, 2	2020-10-27
Sintering tool for the lower die of a sintering device Grant 10,818,633 - Osterwald , et al. October 27, 2	2020-10-27
Method for producing a substrate arrangement, substrate arrangement, and method for connecting a substrate arrangement to an electronic component Grant 10,622,331 - Hinrich , et al.	2020-04-14
Method for manufacturing semiconductor chips Grant 10,607,962 - Osterwald , et al.	2020-03-31
Sintering device Grant 10,483,229 - Osterwald , et al. Nov	2019-11-19
Method for cohesively connecting a first component of a power semiconductor module to a second component of a power semiconductor module Grant 10,438,924 - Becker , et al. O	2019-10-08
Electronic sandwich structure with two parts joined together by means of a sintering layer Grant 10,332,858 - Becker , et al.	2019-06-25
Electronic Sandwich Structure With Two Parts Joined Together By Means Of A Sintering Layer App 20180331065 - Becker; Martin ; et al.	2018-11-15
Power semiconductor contact structure and method for the production thereof Grant 10,079,219 - Becker , et al. September 18, 2	2018-09-18
Method For Manufacturing Semiconductor Chips App 20180240776 - Osterwald; Frank ; et al.	2018-08-23
Power Semiconductor Module With Short-circuit Failure Mode App 20170338193 - Lutz; Josef ; et al.	2017-11-23
Method For Cohesively Connecting A First Component Of A Power Semiconductor Module To A Second Component Of A Power Semiconductor Module App 20170317051 - Becker; Martin ; et al.	2017-11-02
Power Semiconductor Contact Structure And Method For The Production Thereof App 20170317049 - Becker; Martin ; et al.	2017-11-02
Method for creating a connection between metallic moulded bodies and a power semiconductor which is used to bond to thick wires or strips Grant 9,786,627 - Becker , et al. October 10, 2	2017-10-10
Sintering Device App 20170229418 - Osterwald; Frank ; et al.	2017-08-10
Sintering Tool For The Lower Die Of A Sintering Device App 20170221852 - Osterwald; Frank ; et al.	2017-08-03
Sintering Tool And Method For Sintering An Electronic Subassembly App 20170216920 - Osterwald; Frank ; et al.	2017-08-03
Power semiconductor chip with a metallic moulded body for contacting thick wires or strips and method for the production thereof Grant 9,613,929 - Becker , et al. April 4, 2	2017-04-04
Power Semiconductor Chip With A Metallic Moulded Body For Contacting Thick Wires Or Strips And Method For The Production Thereof App 20160225738 - Becker; Martin ; et al.	2016-08-04
Power semiconductor chip with a metallic moulded body for contacting thick wires or strips and method for the production thereof Grant 9,318,421 - Becker , et al. April 19, 2	2016-04-19
Method For Creating A Connection Between Metallic Moulded Bodies And A Power Semiconductor Which Is Used To Bond To Thick Wires Or Strips App 20140230989 - Becker; Martin ; et al.	2014-08-21
Power Semiconductor Chip With A Metallic Moulded Body For Contacting Thick Wires Or Strips And Method For The Production Thereof App 20140225247 - Becker; Martin ; et al.	2014-08-14

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.