Rudik; William John

Patent Applications and Registrations

Patent applications and USPTO patent grants for Rudik; William John.The latest application filed is for "method for reducing coefficient of thermal expansion in chip attach packages".

Company Profile

0.7.2

Rudik; William John - Vestal NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for reducing coefficient of thermal expansion in chip attach packages Grant 6,841,026 - Blumberg , et al. January 11, 2	2005-01-11
Process of fabricating a circuitized structure Grant 6,739,048 - Jones , et al. May 25, 2	2004-05-25
Method for reducing coefficient of thermal expansion in chip attach packages App 20030000081 - Blumberg, Lawrence Robert ; et al.	2003-01-02
Process Of Fabricating A Circuitzed Structure App 20020078562 - Jones, Gerald Walter ; et al.	2002-06-27
Technique for forming resin-impregnated fiberglass sheets with improved resistance to pinholing Grant 6,096,665 - Appelt , et al. August 1, 2	2000-08-01
Electronic device packages having glass free non conductive layers Grant 5,981,880 - Appelt , et al. November 9, 1	1999-11-09
Apparatus and process for improved die adhesion to organic chip carriers Grant 5,955,782 - Kosteva , et al. September 21, 1	1999-09-21
Technique for forming resin-impregnated fiberglass sheets using multiple resins Grant 5,919,525 - Appelt , et al. July 6, 1	1999-07-06
Technique for forming resin-impregnated fiberglass sheets with improved resistance to pinholing Grant 5,858,461 - Appelt , et al. January 12, 1	1999-01-12

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