Rude; Timothy Ryan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Rude; Timothy Ryan.The latest application filed is for "method for low temperature bonding of electronic components".

Company Profile

0.6.11

Rude; Timothy Ryan - Salt Lake City UT
Rude; Timothy Ryan - Baltimore MD
Rude; Timothy Ryan - Hunt Valley MD
Rude, Timothy Ryan - Timonium MD

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method For Low Temperature Bonding Of Electronic Components App 20150060898 - Van Heerden; David ; et al.	2015-03-05
Method for low temperature bonding of electronic components Grant 8,882,301 - Heerden , et al. November 11, 2	2014-11-11
Reactive composite material structures with electrostatic discharge protection and applications thereof Grant 8,336,457 - Weihs , et al. December 25, 2	2012-12-25
Method For Low Temperature Bonding Of Electronic Components App 20110089462 - Van Heerden; David ; et al.	2011-04-21
Reactive composite material structures with electrostatic discharge protection and applications thereof App 20110070460 - Weihs; Timothy P. ; et al.	2011-03-24
Method for fabricating large dimension bonds using reactive multilayer joining Grant 7,810,704 - Duckham , et al. October 12, 2	2010-10-12
Method for fabricating large dimension bonds using reactive multilayer joining Grant 7,635,076 - Duckham , et al. December 22, 2	2009-12-22
Method For Fabricating Temperature Sensitive And Sputter Target Assemblies Using Reactive Multilayer Joining App 20090173626 - Duckham; Alan ; et al.	2009-07-09
Method and Apparatus For Electromagnetic Emission By Reactive Composite Materials App 20090166568 - Weihs; Timothy P. ; et al.	2009-07-02
Method For Fabricating Large Dimension Bonds Using Reactive Multilayer Joining App 20080299410 - Duckham; Alan ; et al.	2008-12-04
Assembly For Fabricating Large Dimension Bonds Using Reactive Multilayer Joining App 20080145695 - Duckham; Alan ; et al.	2008-06-19
Method For Fabricating Large Dimension Bonds Using Reactive Multilayer Joining App 20080131700 - Duckham; Alan ; et al.	2008-06-05
Method for fabricating large dimension bonds using reactive multilayer joining Grant 7,354,659 - Duckham , et al. April 8, 2	2008-04-08
Methods Of Reactive Composite Joining With Minimal Escape Of Joining Material App 20070257364 - Van Heerden; David P. ; et al.	2007-11-08
Method for fabricating large dimension bonds using reactive multilayer joining App 20060219759 - Duckham; Alan ; et al.	2006-10-05
Methods of controlling multilayer foil ignition App 20050142495 - Van Heerden, David Peter ; et al.	2005-06-30

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