Rubino; Judith M.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Rubino; Judith M..The latest application filed is for "metal alloy layer over conductive region of transistor device of different conductive material than conductive region".

Company Profile

0.15.13

Rubino; Judith M. - Ossining NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Reduced electromigration and stressed induced migration of copper wires by surface coating Grant 7,468,320 - Hu , et al. December 23, 2	2008-12-23
Manufacturable CoWP metal cap process for copper interconnects Grant 7,407,605 - Restaino , et al. August 5, 2	2008-08-05
Metal Alloy Layer Over Conductive Region Of Transistor Device Of Different Conductive Material Than Conductive Region App 20070284654 - Rubino; Judith M. ; et al.	2007-12-13
MANUFACTURABLE CoWP METAL CAP PROCESS FOR COPPER INTERCONNECTS App 20070215842 - Restaino; Darryl D. ; et al.	2007-09-20
Ferromagnetic liner for conductive lines of magnetic memory cells Grant 7,259,025 - Leuschner , et al. August 21, 2	2007-08-21
Manufacturable CoWP metal cap process for copper interconnects Grant 7,253,106 - Restaino , et al. August 7, 2	2007-08-07
Electroplated CoWP composite structures as copper barrier layers Grant 7,217,655 - Cabral, Jr. , et al. May 15, 2	2007-05-15
Ferromagnetic liner for conductive lines of magnetic memory cells App 20070105241 - Leuschner; Rainer ; et al.	2007-05-10
Electroplated CoWP composite structures as copper barrier layers Grant 7,193,323 - Cabral, Jr. , et al. March 20, 2	2007-03-20
Self-aligned corrosion stop for copper C4 and wirebond Grant 7,081,680 - Edelstein , et al. July 25, 2	2006-07-25
MANUFACTURABLE CoWP METAL CAP PROCESS FOR COPPER INTERCONNECTS App 20060134911 - Restaino; Darryl D. ; et al.	2006-06-22
Copper recess process with application to selective capping and electroless plating Grant 7,064,064 - Chen , et al. June 20, 2	2006-06-20
Ferromagnetic liner for conductive lines of magnetic memory cells App 20060022286 - Leuschner; Rainer ; et al.	2006-02-02
Copper recess process with application to selective capping and electroless plating Grant 6,975,032 - Chen , et al. December 13, 2	2005-12-13
Copper recess process with application to selective capping and electroless plating App 20050158985 - Chen, Shyng-Tsong ; et al.	2005-07-21
Electroplated CoWP composite structures as copper barrier layers App 20050127518 - Cabral, Cyril JR. ; et al.	2005-06-16
Electroplated CoWP composite structures as copper barrier layers App 20050104216 - Cabral, Cyril JR. ; et al.	2005-05-19
Self-aligned corrosion stop for copper C4 and wirebond App 20040234679 - Edelstein, Daniel C. ; et al.	2004-11-25
Self-aligned corrosion stop for copper C4 and wirebond Grant 6,779,711 - Edelstein , et al. August 24, 2	2004-08-24
Copper recess process with application to selective capping and electroless plating App 20040113279 - Chen, Shyng-Tsong ; et al.	2004-06-17
Method for testing chips on flat solder bumps App 20040087046 - Datta, Madhav ; et al.	2004-05-06
Method for testing chips on flat solder bumps Grant 6,656,750 - Datta , et al. December 2, 2	2003-12-02
Self-aligned corrosion stop for copper C4 and wirebond App 20030072928 - Edelstein, Daniel C. ; et al.	2003-04-17
Process to increase reliability CuBEOL structures Grant 6,503,834 - Chen , et al. January 7, 2	2003-01-07
Process for manufacturing self-aligned corrosion stop for copper C4 and wirebond Grant 6,457,234 - Edelstein , et al. October 1, 2	2002-10-01
Electroless metal liner formation methods App 20020081842 - Sambucetti, Carlos J. ; et al.	2002-06-27
Method for preparing a conductive pad for electrical connection and conductive pad formed Grant 6,335,104 - Sambucetti , et al. January 1, 2	2002-01-01
RFID transponders with paste antennas and flip-chip attachment Grant 6,259,408 - Brady , et al. July 10, 2	2001-07-10

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