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Patent applications and USPTO patent grants for Ruben; David A..The latest application filed is for "electronic package and device including same".
Patent | Date |
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Sealed package and method of forming same Grant 11,419,552 - Ruben , et al. August 23, 2 | 2022-08-23 |
Electronic Package And Device Including Same App 20220248545 - Ruben; David A. ;   et al. | 2022-08-04 |
Pressure Sensor Assembly App 20220244123 - Fenner; Andreas ;   et al. | 2022-08-04 |
System And Method For Valve Control App 20220032017 - SUTANTO; Jemmy ;   et al. | 2022-02-03 |
System And Method For Valve Control App 20220032018 - SUTANTO; Jemmy ;   et al. | 2022-02-03 |
Power source and method of forming same Grant 11,189,390 - Fenner , et al. November 30, 2 | 2021-11-30 |
Sealed implantable medical device and method of forming same Grant 11,103,714 - Barror , et al. August 31, 2 | 2021-08-31 |
Nuclear Radiation Particle Power Converter App 20210210246 - Fenner; Andreas ;   et al. | 2021-07-08 |
Kinetically Limited Nano-scale Diffusion Bond Structures And Methods App 20210197521 - Sandlin; Michael S. ;   et al. | 2021-07-01 |
Hermetic Assembly And Device Including Same App 20210178518 - Ruben; David A. ;   et al. | 2021-06-17 |
Laser Cutting System App 20210154772 - He; Xiangnan ;   et al. | 2021-05-27 |
Kinetically limited nano-scale diffusion bond structures and methods Grant 10,981,355 - Sandlin , et al. April 20, 2 | 2021-04-20 |
Hermetically-sealed Packages Including Feedthrough Assemblies App 20210051812 - Ruben; David A. | 2021-02-18 |
Sealed Package Including Electronic Device And Power Source App 20210045260 - Day; John K. ;   et al. | 2021-02-11 |
Sealed Package And Method Of Forming Same App 20200397373 - Ruben; David A. ;   et al. | 2020-12-24 |
Power source and method of forming same Grant 10,818,811 - Fenner , et al. October 27, 2 | 2020-10-27 |
Hermetically-sealed packages including feedthrough assemblies Grant 10,813,238 - Ruben October 20, 2 | 2020-10-20 |
Nuclear radiation particle power converter Grant 10,811,157 - Fenner , et al. October 20, 2 | 2020-10-20 |
Sealed package and method of forming same Grant 10,765,372 - Ruben , et al. Sep | 2020-09-08 |
Sealed package including electronic device and power source Grant 10,772,228 - Day , et al. Sep | 2020-09-08 |
Power Source And Method Of Forming Same App 20200203034 - FENNER; Andreas ;   et al. | 2020-06-25 |
Power source and method of forming same Grant 10,580,544 - Fenner , et al. | 2020-03-03 |
Hermetic Conductive Feedthroughs For A Semiconductor Wafer App 20200062633 - RUBEN; David A. ;   et al. | 2020-02-27 |
Sealed Package And Method Of Forming Same App 20200015747 - RUBEN; David A. ;   et al. | 2020-01-16 |
Feedthrough assemblies and methods of forming same Grant 10,535,596 - Ruben , et al. Ja | 2020-01-14 |
Hermetic conductive feedthroughs for a semiconductor wafer Grant 10,464,836 - Ruben , et al. No | 2019-11-05 |
Sealed package and method of forming same Grant 10,420,509 - Ruben , et al. Sept | 2019-09-24 |
Surface Texturing Using Energy Pulses App 20190283176 - HE; Xiangnan ;   et al. | 2019-09-19 |
Power Source And Method Of Forming Same App 20190267503 - FENNER; Andreas A. ;   et al. | 2019-08-29 |
Sealed Implantable Medical Device And Method Of Forming Same App 20190255335 - Barror; Michael W. ;   et al. | 2019-08-22 |
Hermetically-sealed Packages Including Feedthrough Assemblies App 20190166709 - RUBEN; David A. | 2019-05-30 |
Power source and method of forming same Grant 10,290,757 - Fenner , et al. | 2019-05-14 |
Nuclear Radiation Particle Power Converter App 20190066861 - FENNER; Andreas ;   et al. | 2019-02-28 |
Sealed Package And Method Of Forming Same App 20190038223 - RUBEN; David A. ;   et al. | 2019-02-07 |
Kinetically Limited Nano-scale Diffusion Bond Structures And Methods App 20190039347 - Sandlin; Michael S. ;   et al. | 2019-02-07 |
Feedthrough Assemblies And Methods Of Forming Same App 20180374786 - RUBEN; David A. ;   et al. | 2018-12-27 |
Hermetically-sealed packages including feedthrough assemblies Grant 10,136,535 - Ruben November 20, 2 | 2018-11-20 |
Kinetically limited nano-scale diffusion bond structures and methods Grant 10,124,559 - Sandlin , et al. November 13, 2 | 2018-11-13 |
Sealed package and method of forming same Grant 10,098,589 - Ruben , et al. October 16, 2 | 2018-10-16 |
Nuclear radiation particle power converter Grant 10,096,393 - Fenner , et al. October 9, 2 | 2018-10-09 |
Implantable Medical Devices And Methods Of Forming Same App 20180263132 - RUBEN; David A. ;   et al. | 2018-09-13 |
Power Source And Method Of Forming Same App 20180158561 - Fenner; Andreas ;   et al. | 2018-06-07 |
Implantable medical device system including feedthrough assembly and method of forming same Grant 9,968,794 - Ruben , et al. May 15, 2 | 2018-05-15 |
Error correction techniques in surgical navigation Grant 9,913,693 - Schulhauser , et al. March 13, 2 | 2018-03-13 |
Feedthrough assemblies Grant 9,865,533 - Ruben , et al. January 9, 2 | 2018-01-09 |
Embedded metallic structures in glass Grant 9,832,867 - Day , et al. November 28, 2 | 2017-11-28 |
Devices formed with techniques for bonding substrates using an intermediate layer Grant 9,688,053 - Ruben , et al. June 27, 2 | 2017-06-27 |
Sealed Package And Method Of Forming Same App 20170172505 - Ruben; David A. ;   et al. | 2017-06-22 |
Embedded Metallic Structures In Glass App 20170150600 - Day; John K. ;   et al. | 2017-05-25 |
Sealed Package Including Electronic Device And Power Source App 20170127543 - Day; John K. ;   et al. | 2017-05-04 |
Sealed Implantable Medical Device And Method Of Forming Same App 20170100597 - Barror; Michael W. ;   et al. | 2017-04-13 |
Media-exposed interconnects for transducers Grant 9,616,223 - Schugt , et al. April 11, 2 | 2017-04-11 |
Power Source And Method Of Forming Same App 20170069775 - Fenner; Andreas A. ;   et al. | 2017-03-09 |
Wafer-scale package including power source Grant 9,431,312 - O'Brien , et al. August 30, 2 | 2016-08-30 |
Wafer-scale Package Including Power Source App 20160204004 - O'Brien; Richard J. ;   et al. | 2016-07-14 |
Feedthrough Assemblies And Methods Of Forming Same App 20160190052 - Ruben; David A. ;   et al. | 2016-06-30 |
Implantable Medical Devices And Methods Of Forming Same App 20160184593 - Ruben; David A. ;   et al. | 2016-06-30 |
Kinetically Limited Nano-scale Diffusion Bond Structures And Methods App 20160185081 - Sandlin; Michael S. ;   et al. | 2016-06-30 |
Hermetically-sealed Packages Including Feedthrough Assemblies App 20160192524 - Ruben; David A. | 2016-06-30 |
Wafer-scale package including power source Grant 9,318,400 - O'Brien , et al. April 19, 2 | 2016-04-19 |
Power sources suitable for use in implantable medical devices and corresponding fabrication methods Grant 9,252,415 - Askarinya , et al. February 2, 2 | 2016-02-02 |
Devices Formed With Techniques For Bonding Substrates Using An Intermediate Layer App 20150367598 - Ruben; David A. ;   et al. | 2015-12-24 |
Laser assisted direct bonding Grant 9,171,721 - Danzl , et al. October 27, 2 | 2015-10-27 |
Nuclear Radiation Particle Power Converter App 20150279491 - Fenner; Andreas ;   et al. | 2015-10-01 |
Techniques for bonding substrates using an intermediate layer Grant 9,120,287 - Ruben , et al. September 1, 2 | 2015-09-01 |
Hermetic Conductive Feedthroughs For A Semiconductor Wafer App 20150101841 - Ruben; David A. ;   et al. | 2015-04-16 |
Techniques For Bonding Substrates Using An Intermediate Layer App 20150022983 - Ruben; David A. ;   et al. | 2015-01-22 |
Hermetically-sealed Electrical Circuit Apparatus App 20140374145 - Gerrish; Paul F. ;   et al. | 2014-12-25 |
Techniques for bonding substrates using an intermediate layer Grant 8,796,109 - Ruben , et al. August 5, 2 | 2014-08-05 |
Wafer-scale Package Including Power Source App 20140171822 - O'Brien; Richard J. ;   et al. | 2014-06-19 |
Wafer-scale package including power source Grant 8,666,505 - O'Brien , et al. March 4, 2 | 2014-03-04 |
Power Sources Suitable For Use In Implantable Medical Devices And Corresponding Fabrication Methods App 20130337313 - Askarinya; Mohsen ;   et al. | 2013-12-19 |
Layered structure for corrosion resistant interconnect contacts Grant 8,461,681 - Ruben June 11, 2 | 2013-06-11 |
Hermetic wafer-to-wafer bonding with electrical interconnection Grant 8,433,402 - Ruben , et al. April 30, 2 | 2013-04-30 |
Implantable capacitive pressure sensor apparatus and methods regarding same Grant 8,424,388 - Mattes , et al. April 23, 2 | 2013-04-23 |
Implantable Capacitive Pressure Sensor Apparatus and Methods Regarding Same App 20120197155 - Mattes; Michael F. ;   et al. | 2012-08-02 |
Techniques For Bonding Substrates Using An Intermediate Layer App 20120161305 - Ruben; David A. ;   et al. | 2012-06-28 |
Error Correction Techniques In Surgical Navigation App 20120108954 - Schulhauser; Randal C. ;   et al. | 2012-05-03 |
Wafer-scale Package Including Power Source App 20120101540 - O'Brien; Richard J. ;   et al. | 2012-04-26 |
Laser Assisted Direct Bonding App 20120100318 - Danzl; Ralph B. ;   et al. | 2012-04-26 |
Metallization with tailorable coefficient of thermal expansion Grant 8,141,556 - Ruben March 27, 2 | 2012-03-27 |
Hermetic Wafer-to-wafer Bonding With Electrical Interconnection App 20110270099 - Ruben; David A. ;   et al. | 2011-11-03 |
Hermetic Wafer-to-wafer Bonding With Electrical Interconnection App 20110270341 - Ruben; David A. ;   et al. | 2011-11-03 |
Hermeticity testing Grant 7,902,851 - Fenner , et al. March 8, 2 | 2011-03-08 |
Pressure sensor configurations for implantable medical electrical leads Grant 7,886,608 - Mothilal , et al. February 15, 2 | 2011-02-15 |
Laser bonding tool with improved bonding accuracy Grant 7,872,208 - Ruben , et al. January 18, 2 | 2011-01-18 |
Hermeticity Testing App 20100315110 - Fenner; Andreas Armin ;   et al. | 2010-12-16 |
Hermetically-sealed Electrical Circuit Apparatus App 20100314149 - Gerrish; Paul F. ;   et al. | 2010-12-16 |
Encapsulation circuitry on a substrate Grant 7,682,878 - Ruben , et al. March 23, 2 | 2010-03-23 |
Pressure Sensor Configurations For Implantable Medical Electrical Leads App 20090308169 - Mothilal; Kamal Deep ;   et al. | 2009-12-17 |
Pressure sensor configurations for implantable medical electrical leads Grant 7,591,185 - Mothilal , et al. September 22, 2 | 2009-09-22 |
Layered Structure For Corrosion Resistant Interconnect Contacts App 20080265423 - Ruben; David A. | 2008-10-30 |
Metallization With Tailorable Coefficient Of Thermal Expansion App 20080269623 - Ruben; David A. | 2008-10-30 |
Freeform substrates and devices Grant 7,335,530 - Ruben February 26, 2 | 2008-02-26 |
Encapsulation Circuitry On A Substrate App 20080038878 - Ruben; David A. ;   et al. | 2008-02-14 |
Assembly including a circuit and an encapsulation frame, and method of making the same Grant 7,288,847 - Ruben , et al. October 30, 2 | 2007-10-30 |
Media-exposed interconnects for transducers App 20070160748 - Schugt; Michael A. ;   et al. | 2007-07-12 |
Laser bonding tool with improved bonding accuracy App 20060219672 - Ruben; David A. ;   et al. | 2006-10-05 |
Assembly including a circuit and an encapsulation frame, and method of making the same App 20060163747 - Ruben; David A. ;   et al. | 2006-07-27 |
Electrical connection through nonmetal App 20060125114 - Ruben; David A. | 2006-06-15 |
Implantable medical device including a surface-mount terminal array Grant 6,963,780 - Ruben , et al. November 8, 2 | 2005-11-08 |
Visual user interface for hair styling apparatus App 20050011533 - Ruben, David A | 2005-01-20 |
Freeform substrates and devices App 20050004616 - Ruben, David A. | 2005-01-06 |
Apparatus and method for laser welding of ribbons for electrical connections App 20040256367 - Ruben, David A. | 2004-12-23 |
Freeform substrates and devices Grant 6,787,891 - Ruben September 7, 2 | 2004-09-07 |
User interface and display for appliances Grant D494,319 - Ruben August 10, 2 | 2004-08-10 |
Apparatus and method for laser welding of ribbons Grant 6,717,100 - Ruben April 6, 2 | 2004-04-06 |
Electrical connection through nonmetal App 20040056350 - Ruben, David A. | 2004-03-25 |
Hair dryer assembly App 20040047620 - Ruben, David A. | 2004-03-11 |
Implantable medical device including a surface-mount terminal array App 20030144707 - Ruben, David A. ;   et al. | 2003-07-31 |
Apparatus and method for laser welding of ribbons App 20030127434 - Ruben, David A. | 2003-07-10 |
Apparatus and method for laser welding of ribbons Grant 6,501,043 - Ruben December 31, 2 | 2002-12-31 |
Freeform substrates and devices App 20020066940 - Ruben, David A. | 2002-06-06 |
Packaging Grant D455,071 - Ruben April 2, 2 | 2002-04-02 |
Accelerometer for implantable medical device Grant 6,216,537 - Henschel , et al. April 17, 2 | 2001-04-17 |
High output sensor and accelerometer for implantable medical device Grant 6,038,475 - Sikorski , et al. March 14, 2 | 2000-03-14 |
High output sensor and accelerometer implantable medical device Grant 5,911,738 - Sikorski , et al. June 15, 1 | 1999-06-15 |
Shock resistant accelerometer for implantable medical device Grant 5,885,471 - Ruben , et al. March 23, 1 | 1999-03-23 |
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