Ruan; Wei Wei
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ruan; Wei Wei.The latest application filed is for "structure and method for semiconductor testing".
- Ruan; Wei Wei - Shanghai CN
| Patent | Date |
|---|---|
| Reliability test structure for multilevel interconnect Grant 8,323,990 - Shi , et al. December 4, 2 | 2012-12-04 |
| Multi-purpose poly edge test structure Grant 8,164,091 - Shi , et al. April 24, 2 | 2012-04-24 |
| Structure And Method For Semiconductor Testing App 20110074459 - Ruan; Wei Wei ; et al. | 2011-03-31 |
| Multi-purpose poly edge test structure App 20090033354 - Shi; Wen ; et al. | 2009-02-05 |
| Multi-purpose poly edge test structure Grant 7,439,538 - Shi , et al. October 21, 2 | 2008-10-21 |
| Reliability test structure for multilevel interconnect App 20080128693 - Shi; Wen ; et al. | 2008-06-05 |
| Multi-purpose poly edge test structure App 20080128692 - Shi; Wen ; et al. | 2008-06-05 |
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