Rowlands; Michael
Patent Applications and Registrations
Patent applications and USPTO patent grants for Rowlands; Michael.The latest application filed is for "bend compensation for conductive traces on printed circuit boards".
- Rowlands; Michael - Milford MA
- Rowlands; Michael - Naperville IL
- Rowlands; Michael - Lisle IL US
| Patent | Date |
|---|---|
| Bend Compensation For Conductive Traces On Printed Circuit Boards App 20210227683 - Rowlands; Michael ; et al. | 2021-07-22 |
| Connector for mounting on a circuit board Grant 10,566,719 - Peloza , et al. Feb | 2020-02-18 |
| Connector with dual card slots Grant 10,230,186 - Bogiel , et al. | 2019-03-12 |
| Electrical connector Grant 10,230,192 - Peloza , et al. | 2019-03-12 |
| Electrical Connector App 20190027856 - PELOZA; Kirk B. ; et al. | 2019-01-24 |
| Electrical connector Grant 10,084,257 - Peloza , et al. September 25, 2 | 2018-09-25 |
| Connector App 20180212349 - Peloza; Kirk B. ; et al. | 2018-07-26 |
| Electrical Connector App 20180166820 - PELOZA; Kirk B. ; et al. | 2018-06-14 |
| Connector With Dual Card Slots App 20180123271 - BOGIEL; Steven B. ; et al. | 2018-05-03 |
| Connector having a housing with closed loop terminals Grant 9,923,292 - Peloza , et al. March 20, 2 | 2018-03-20 |
| Differentially coupled connector Grant 9,882,314 - Casher , et al. January 30, 2 | 2018-01-30 |
| Connector with tuned terminal beam Grant 9,660,383 - Regnier , et al. May 23, 2 | 2017-05-23 |
| Differentially Coupled Connector App 20170047688 - CASHER; Patrick R. ; et al. | 2017-02-16 |
| High density connector Grant 9,525,245 - Regnier , et al. December 20, 2 | 2016-12-20 |
| Differentially coupled connector Grant 9,515,421 - Casher , et al. December 6, 2 | 2016-12-06 |
| Connector With Tuned Terminal Beam App 20160315419 - Regnier; Kent E. ; et al. | 2016-10-27 |
| High Density Connector App 20160285210 - Regnier; Kent E. ; et al. | 2016-09-29 |
| High density connector Grant 9,385,455 - Regnier , et al. July 5, 2 | 2016-07-05 |
| Connector App 20160181713 - PELOZA; Kirk B. ; et al. | 2016-06-23 |
| High Density Connector App 20160036147 - Regnier; Kent E. ; et al. | 2016-02-04 |
| High density connector Grant 9,246,251 - Regnier , et al. January 26, 2 | 2016-01-26 |
| Differentially Coupled Connector App 20150295358 - Casher; Patrick ; et al. | 2015-10-15 |
| Differentially coupled connector Grant 9,083,130 - Casher , et al. July 14, 2 | 2015-07-14 |
| High Density Connector App 20150140861 - Regnier; Kent E. ; et al. | 2015-05-21 |
| Differentially Coupled Connector App 20130196550 - Casher; Patrick R. ; et al. | 2013-08-01 |
| Liquid crystal polymer layer for encapsulation and improved hermiticity of circuitized substrates Grant 8,143,530 - Das , et al. March 27, 2 | 2012-03-27 |
| Liquid Crystal Polymer Layer For Encapsulation And Improved Hermiticity Of Circuitized Substrates App 20120069288 - Das; Rabindra ; et al. | 2012-03-22 |
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