loadpatents
Patent applications and USPTO patent grants for Rouya; Eric.The latest application filed is for "cobalt filling of interconnects in microelectronics".
Patent | Date |
---|---|
Cobalt filling of interconnects in microelectronics Grant 11,434,578 - Commander , et al. September 6, 2 | 2022-09-06 |
Cobalt Filling of Interconnects in Microelectronics App 20210222314 - Commander; John ;   et al. | 2021-07-22 |
Cobalt filling of interconnects in microelectronics Grant 10,995,417 - Commander , et al. May 4, 2 | 2021-05-04 |
Cobalt Filling of Interconnects in Microelectronics App 20200040478 - Commander; John ;   et al. | 2020-02-06 |
Copper Electrodeposition in Microelectronics App 20190390356 - Paneccasio, Jr.; Vincent ;   et al. | 2019-12-26 |
Levelers for copper deposition in microelectronics Grant 10,294,574 - Whitten , et al. | 2019-05-21 |
Electrodeposition of Copper App 20160281251 - Paneccasio; Vincent ;   et al. | 2016-09-29 |
Levelers For Copper Deposition In Microelectronics App 20160076160 - Whitten; Kyle ;   et al. | 2016-03-17 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.