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Enhanced Adhesive Materials And Processes For 3d Applications App 20170166784 - Hedrick; James L. ;   et al. | 2017-06-15 |
Removal of spurious microwave modes via flip-chip crossover Grant 9,531,055 - Abraham , et al. December 27, 2 | 2016-12-27 |
Chip mode isolation and cross-talk reduction through buried metal layers and through-vias Grant 9,520,547 - Abraham , et al. December 13, 2 | 2016-12-13 |
Method of fabricating a coplanar waveguide device including removal of spurious microwave modes via flip-chip crossover Grant 9,455,392 - Abraham , et al. September 27, 2 | 2016-09-27 |
Chip mode isolation and cross-talk reduction through buried metal layers and through-vias Grant 9,397,283 - Abraham , et al. July 19, 2 | 2016-07-19 |
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Removal Of Spurious Microwave Modes Via Flip-chip Crossover App 20160204330 - Abraham; David W. ;   et al. | 2016-07-14 |
Removal of spurious microwave modes via flip-chip crossover Grant 9,219,298 - Abraham , et al. December 22, 2 | 2015-12-22 |
Suspended Superconducting Qubits App 20150340584 - Chang; Josephine B. ;   et al. | 2015-11-26 |
Suspended superconducting qubits Grant 9,177,814 - Chang , et al. November 3, 2 | 2015-11-03 |
Suspended Superconducting Qubits App 20150311422 - Chang; Josephine B. ;   et al. | 2015-10-29 |
Lock and key through-via method for wafer level 3D integration and structures produced thereby Grant 9,064,717 - Purushothaman , et al. June 23, 2 | 2015-06-23 |
Chip Mode Isolation And Cross-talk Reduction Through Buried Metal Layers And Through-vias App 20150155468 - Abraham; David W. ;   et al. | 2015-06-04 |
Low-loss superconducting devices Grant 8,954,125 - Corcoles Gonzalez , et al. February 10, 2 | 2015-02-10 |
Chip Mode Isolation And Cross-talk Reduction Through Buried Metal Layers And Through-vias App 20140274725 - Abraham; David W. ;   et al. | 2014-09-18 |
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Suspended Superconducting Qubits App 20140264286 - Chang; Josephine B. ;   et al. | 2014-09-18 |
Low-loss Superconducting Devices App 20130029848 - Gonzalez; Antonio D. Corcoles ;   et al. | 2013-01-31 |
Lock and key through-via method for wafer level 3D integration and structures produced Grant 8,093,099 - Purushothaman , et al. January 10, 2 | 2012-01-10 |
Lock and Key Through-Via Method for Wafer Level 3D Integration and Structures Produced Thereby App 20110111560 - Purushothaman; Sampath ;   et al. | 2011-05-12 |
Lock and key through-via method for wafer level 3 D integration and structures produced Grant 7,855,455 - Purushothaman , et al. December 21, 2 | 2010-12-21 |
Lock and Key Through-Via Method for Wafer Level 3D Integration and Structures Produced App 20100200992 - Purushothaman; Sampath ;   et al. | 2010-08-12 |
Lock and Key Through-Via Method for Wafer Level 3 D Integration and Structures Produced App 20100078770 - Purushothaman; Sampath ;   et al. | 2010-04-01 |