Rossi; Nic

Patent Applications and Registrations

Patent applications and USPTO patent grants for Rossi; Nic.The latest application filed is for "semiconductor package with corner pins".

Company Profile

1.11.19

Rossi; Nic - Causeway Bay N/A HK
Rossi; Nic - Radio HK
Rossi; Nic - Radio City HK
Rossi; Nic - Hennessy HK
Rossi; Nic - Causeway HK

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Spot plated leadframe and IC bond pad via array design for copper wire Grant 9,230,928 - Warren , et al. January 5, 2	2016-01-05
Semiconductor package with corner pins Grant 9,142,491 - Warren , et al. September 22, 2	2015-09-22
Semiconductor packages with reduced solder voiding Grant 9,029,991 - Warren , et al. May 12, 2	2015-05-12
Semiconductor Package with Corner Pins App 20140091448 - Warren; Robert W. ; et al.	2014-04-03
Wafer level package with thermal pad for higher power dissipation Grant 8,552,540 - Warren , et al. October 8, 2	2013-10-08
Copper Sphere Array Package App 20130256885 - Warren; Robert W. ; et al.	2013-10-03
Shielded USB connector module with molded hood and LED light pipe Grant 8,540,529 - Warren , et al. September 24, 2	2013-09-24
Solid Via Pins For Improved Thermal And Electrical Conductivity App 20130208424 - Warren; Robert W. ; et al.	2013-08-15
Systems and methods of tamper proof packaging of a semiconductor device Grant 8,455,990 - Warren , et al. June 4, 2	2013-06-04
Copper Stud Bump Wafer Level Package App 20130087915 - Warren; Robert W. ; et al.	2013-04-11
Spot Plated Leadframe and IC Bond Pad Via Array Design for Copper Wire App 20130062742 - Warren; Robert W. ; et al.	2013-03-14
Shielded USB Connector Module with Molded Hood and LED Light Pipe App 20130034990 - Warren; Robert W. ; et al.	2013-02-07
Externally Wire Bondable Chip Scale Package in a System-in-Package Module App 20120326304 - Warren; Robert W. ; et al.	2012-12-27
Wafer Level Package With Thermal Pad For Higher Power Dissipation App 20120286408 - Warren; Robert W. ; et al.	2012-11-15
Unpackaged and packaged IC stacked in a system-in-package module App 20120241954 - Warren; Robert W. ; et al.	2012-09-27
Integrated led in system-in-package module App 20120188738 - Warren; Robert W. ; et al.	2012-07-26
Semiconductor packages with reduced solder voiding App 20120119341 - Warren; Robert W. ; et al.	2012-05-17
Systems and methods for improved heat dissipation in semiconductor packages App 20120104591 - Warren; Robert W. ; et al.	2012-05-03
Systems and Methods for Heat Dissipation Using Thermal Conduits App 20120032350 - Warren; Robert W. ; et al.	2012-02-09
Systems and Methods of Improved Heat Dissipation with Variable Pitch Grid Array Packaging App 20110001230 - Li; Jianjun ; et al.	2011-01-06
Systems and Methods of Tamper Proof Packaging of a Semiconductor Device App 20100213590 - Warren; Robert W. ; et al.	2010-08-26

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