Rosner; Raymond James
Patent Applications and Registrations
Patent applications and USPTO patent grants for Rosner; Raymond James.The latest application filed is for "very dense integrated circuit package and method for forming the same".
- Rosner; Raymond James - Colchester VT
| Patent | Date |
|---|---|
| Very dense integrated circuit package and method for forming the same Grant 5,866,443 - Pogge , et al. February 2, 1 | 1999-02-02 |
| Very dense integrated circuit package Grant 5,770,884 - Pogge , et al. June 23, 1 | 1998-06-23 |
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