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Patent applications and USPTO patent grants for Rosenblat; Michael L..The latest application filed is for "mold-resistant corrugated carboard for void-forming structures and process".
Patent | Date |
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Mold-resistant corrugated carboard for void-forming structures and process Grant 6,794,017 - Comeau , et al. September 21, 2 | 2004-09-21 |
Mold-resistant corrugated carboard for void-forming structures and process App 20040033343 - Comeau, Dominic Hamel ;   et al. | 2004-02-19 |
Apparatus for forming voids under concrete floors Grant 6,116,568 - Rosenblat , et al. September 12, 2 | 2000-09-12 |
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